Inventor · disambiguated record

Hsiu-Chi Liu

Also filed as: LIU HSIU-CHI

5 granted patents·5 citations·filing 2019–2022

67Inventor score

Technology areasH10W

Files withADVANCED SEMICONDUCTOR ENG5

Top patents by PatentIndex Score

5 records

0195US11342282B2Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 24, 2022·4 cites·26 claims
0288US12374631B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 29, 2025·1 cites·14 claims
0354US11798858B2Semiconductor package structure including reinforcement component and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 24, 2023·0 cites·16 claims
0448US11094649B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 17, 2021·0 cites·26 claims
0543US10943843B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 9, 2021·0 cites·19 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →