Inventor · disambiguated record
Jea Won Kim
Also filed as: KIM JEA-WON
3 granted patents·3 pending applications·0 citations·filing 2005–2021
44Inventor score
Top patents by PatentIndex Score
6 records- 0161US11876012B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·21 claims
- 0245US10811302B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·10 claims
- 0344US11139220B2Flexible semiconductor package formed by roll-to-roll processHAESUNG DS CO LTD·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 0442US2023130743A1Artificial Ankle Joint Bearing ElementCORENTEC CO LTD·Filed 2021·Application pending·0 cites
- 0533US2005270427A1Apparatus and method of controlling saturation of color imageKIM JEA-WON·Filed 2005·Application pending·0 cites
- 0629US2007081743A1Image interpolation apparatus and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →