Inventor · disambiguated record
Mathew J. Manusharow
Also filed as: MANUSHAROW MATHEW · MANUSHAROW MATHEW J
64 granted patents·15 pending applications·473 citations·filing 2006–2025
98Inventor score
Top patents by PatentIndex Score
79 records- 0199US8866308B2High density interconnect device and methodINTEL CORP·Filed 2012·Granted Oct 21, 2014·50 cites·19 claims
- 0298US12051651B2Size and efficiency of diesINTEL CORP·Filed 2023·Granted Jul 30, 2024·2 cites·20 claims
- 0398US8901748B2Direct external interconnect for embedded interconnect bridge packageMANUSHAROW MATHEW J·Filed 2013·Granted Dec 2, 2014·122 cites·11 claims
- 0497US10847467B2Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling sameINTEL CORP·Filed 2019·Granted Nov 24, 2020·21 cites·20 claims
- 0597US9275971B2Bridge interconnect with air gap in package assemblyINTEL CORP·Filed 2014·Granted Mar 1, 2016·33 cites·21 claims
- 0697US8872349B2Bridge interconnect with air gap in package assemblyCHIU CHIA-PIN·Filed 2012·Granted Oct 28, 2014·83 cites·24 claims
- 0797US8304913B2Methods of forming fully embedded bumpless build-up layer packages and structures formed therebyNALLA RAVI K·Filed 2010·Granted Nov 6, 2012·46 cites·11 claims
- 0896US10163557B2Helical plated through-hole package inductorINTEL CORP·Filed 2015·Granted Dec 25, 2018·6 cites·9 claims
- 0994US8431438B2Forming in-situ micro-feature structures with coreless packagesNALLA RAVI K·Filed 2010·Granted Apr 30, 2013·17 cites·13 claims
- 1091US10651525B2Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubsINTEL CORP·Filed 2018·Granted May 12, 2020·5 cites·11 claims
- 1190US2025323169A1Improving size and efficiency of diesINTEL CORP·Filed 2025·Application pending·0 cites
- 1289US10998120B2Method of making an inductorINTEL CORP·Filed 2018·Granted May 4, 2021·1 cites·14 claims
- 1389US9992859B2Low loss and low cross talk transmission lines using shaped viasINTEL CORP·Filed 2015·Granted Jun 5, 2018·5 cites·4 claims
- 1489US8772924B2Forming in-situ micro-feature structures with coreless packagesINTEL CORP·Filed 2013·Granted Jul 8, 2014·7 cites·7 claims
- 1589US2024413089A1Improving size and efficiency of diesINTEL CORP·Filed 2024·Application pending·0 cites
- 1689US2024421098A1High density interconnect device and methodTAHOE RES LTD·Filed 2024·Application pending·0 cites
- 1788US8580616B2Methods of forming fully embedded bumpless build-up layer packages and structures formed therebyNALLA RAVI K·Filed 2012·Granted Nov 12, 2013·8 cites·13 claims
- 1888US8508037B2Bumpless build-up layer and laminated core hybrid structures and methods of assembling sameMANUSHAROW MATHEW J·Filed 2010·Granted Aug 13, 2013·9 cites·15 claims
- 1987US10446499B2High density interconnect device and methodINTEL CORP·Filed 2017·Granted Oct 15, 2019·3 cites·6 claims
- 2086US11437346B2Package structure having substrate thermal vent structures for inductor coolingINTEL CORP·Filed 2018·Granted Sep 6, 2022·6 cites·17 claims
- 2186US10490503B2Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling sameINTEL CORP·Filed 2018·Granted Nov 26, 2019·4 cites·26 claims
- 2285US8952540B2In situ-built pin-grid arrays for coreless substrates, and methods of making sameROY MIHIR K·Filed 2011·Granted Feb 10, 2015·7 cites·24 claims
- 2384US12094827B2Size and efficiency of diesINTEL CORP·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 2484US12094831B2High density interconnect device and methodTAHOE RES LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 2580US9899311B2Hybrid pitch package with ultra high density interconnect capabilityINTEL CORP·Filed 2016·Granted Feb 20, 2018·2 cites·22 claims
- 2680US9198293B2Non-cylindrical conducting shapes in multilayer laminated substrate coresCHASE HAROLD R·Filed 2013·Granted Nov 24, 2015·8 cites·20 claims
- 2779US10085341B2Direct chip attach using embedded tracesINTEL CORP·Filed 2017·Granted Sep 25, 2018·2 cites·10 claims
- 2879US9633938B2Hybrid pitch package with ultra high density interconnect capabilityINTEL CORP·Filed 2015·Granted Apr 25, 2017·2 cites·22 claims
- 2978US11715695B2Size and efficiency of diesINTEL CORP·Filed 2021·Granted Aug 1, 2023·0 cites·22 claims
- 3078US11664320B2High density interconnect device and methodTAHOE RES LTD·Filed 2021·Granted May 30, 2023·0 cites·18 claims
- 3178US11608564B2Helical plated through-hole package inductorINTEL CORP·Filed 2021·Granted Mar 21, 2023·0 cites·13 claims
- 3278US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 3377US11791528B2Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial lineINTEL CORP·Filed 2022·Granted Oct 17, 2023·0 cites·19 claims
- 3476US10312007B2Inductor formed in substrateINTEL CORP·Filed 2012·Granted Jun 4, 2019·3 cites·11 claims
- 3575US11961804B2Size and efficiency of diesINTEL CORP·Filed 2020·Granted Apr 16, 2024·0 cites·9 claims
- 3675US9521751B2Weaved electrical components in a substrate package coreINTEL CORP·Filed 2013·Granted Dec 13, 2016·2 cites·21 claims
- 3773US10886228B2Improving size and efficiency of diesINTEL CORP·Filed 2015·Granted Jan 5, 2021·1 cites·8 claims
- 3872US10186465B2Package-integrated microchannelsINTEL CORP·Filed 2015·Granted Jan 22, 2019·2 cites·25 claims
- 3971US11329358B2Low loss and low cross talk transmission lines having l-shaped cross sectionsINTEL CORP·Filed 2020·Granted May 10, 2022·0 cites·9 claims
- 4071US9589866B2Bridge interconnect with air gap in package assemblyINTEL CORP·Filed 2016·Granted Mar 7, 2017·1 cites·18 claims
- 4171US9478476B2Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic packageMALLIK DEBENDRA·Filed 2011·Granted Oct 25, 2016·3 cites·17 claims
- 4270US9406587B2Substrate conductor structure and methodCHASE HAROLD RYAN·Filed 2012·Granted Aug 2, 2016·2 cites·14 claims
- 4369US12002745B2High performance integrated RF passives using dual lithography processINTEL CORP·Filed 2021·Granted Jun 4, 2024·0 cites·5 claims
- 4468US9622350B2Method of forming a circuit boardROY MIHIR K·Filed 2013·Granted Apr 11, 2017·1 cites·12 claims
- 4568US9526175B2Suspended inductor microelectronic structuresMANUSHAROW MATHEW J·Filed 2012·Granted Dec 20, 2016·2 cites·14 claims
- 4667US11158578B2High density interconnect device and methodINTEL CORP·Filed 2019·Granted Oct 26, 2021·0 cites·8 claims
- 4766US10410939B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2015·Granted Sep 10, 2019·1 cites·25 claims
- 4862US9552977B2Landside stiffening capacitors to enable ultrathin and other low-Z productsINTEL CORP·Filed 2012·Granted Jan 24, 2017·1 cites·15 claims
- 4961US9275975B2Electronic package and method of connecting a first die to a second die to form an electronic packageCHASE HAROLD RYAN·Filed 2014·Granted Mar 1, 2016·1 cites·9 claims
- 5060US10734282B2Substrate conductor structure and methodINTEL CORP·Filed 2018·Granted Aug 4, 2020·0 cites·11 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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