Inventor · disambiguated record
Mario Cortese
Also filed as: CORTESE MARIO · CORTESE MARIO FRANCESCO
23 granted patents·2 pending applications·191 citations·filing 2006–2023
95Inventor score
Files withST MICROELECTRONICS SRL7SCUOLA SUPERIORE DI STUDI UNIV E DI PERFEZIONAMENTO SANTANNA6BALDO LORENZO2AMAZON TECH INC1CONTI SEBASTIANO1
Top patents by PatentIndex Score
25 records- 0197US8433084B2Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereofCONTI SEBASTIANO·Filed 2010·Granted Apr 30, 2013·65 cites·32 claims
- 0294US7875942B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeST MICROELECTRONICS SRL·Filed 2008·Granted Jan 25, 2011·31 cites·45 claims
- 0392US8847340B2Packaged sensor structure having sensor opening and package opening aligned with sensor elementST MICROELECTRONICS SRL·Filed 2013·Granted Sep 30, 2014·10 cites·19 claims
- 0490US9096424B2Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereofST MICROELECTRONICS SRL·Filed 2014·Granted Aug 4, 2015·8 cites·19 claims
- 0589US8787600B2Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereofST MICROELECTRONICS SRL·Filed 2013·Granted Jul 22, 2014·8 cites·13 claims
- 0688US8134214B2Electronic device, system, and method comprising differential sensor MEMS devices and drilled substratesBALDO LORENZO·Filed 2009·Granted Mar 13, 2012·14 cites·48 claims
- 0785US11432988B2Actuation system for hip orthosisSCUOLA SUPERIORE DI STUDI UNIV E DI PERFEZIONAMENTO SANTANNA·Filed 2020·Granted Sep 6, 2022·2 cites·12 claims
- 0884US8124895B2Planar microelectromechanical device having a stopper structure for out-of-plane movementsMERASSI ANGELO·Filed 2009·Granted Feb 28, 2012·21 cites·34 claims
- 0983US7616451B2Semiconductor package substrate and method, in particular for MEMS devicesST MICROELECTRONICS SRL·Filed 2006·Granted Nov 10, 2009·9 cites·28 claims
- 1080US10736809B2Ergonomic exoskeleton system for the upper limbSCUOLA SUPERIORE DI STUDI UNIV E DI PERFEZIONAMENTO SANT'ANNA·Filed 2016·Granted Aug 11, 2020·3 cites·11 claims
- 1179US10603242B2Actuation system for hip orthosisSCUOLA SUPERIORE DI STUDI UNIV E DI PERFEZIONAMENTO SANTANNA·Filed 2016·Granted Mar 31, 2020·3 cites·8 claims
- 1278US8837754B2Microelectromechanical transducer and corresponding assembly processFORMOSA KEVIN·Filed 2012·Granted Sep 16, 2014·8 cites·41 claims
- 1377US8546895B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeCORTESE MARIO·Filed 2011·Granted Oct 1, 2013·3 cites·46 claims
- 1476US8043881B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeST MICROELECTRONICS SRL·Filed 2010·Granted Oct 25, 2011·2 cites·21 claims
- 1575US12377009B2Exoskeleton for upper armSCUOLA SUPERIORE DI STUDI UNIV E DI PERFEZIONAMENTO SANTANNA·Filed 2023·Granted Aug 5, 2025·0 cites·2 claims
- 1675US11872176B2Exoskeleton for upper armSCUOLA SUPERIORE DI STUDI UNIV E DI PERFEZIONAMENTO SANTANNA·Filed 2018·Granted Jan 16, 2024·2 cites·17 claims
- 1767US11413208B2Kinematical chain for assisting the motion of a spherical jointSCUOLA SUPERIORE DI STUDI UNIV E DI PERFEZIONAMENTO SANTANNA·Filed 2018·Granted Aug 16, 2022·1 cites·9 claims
- 1863US11540969B2Ergonomic exoskeleton system for the upper limbSCUOLA SUPERIORE DI STUDI UNIV E DI PERFEZIONAMENTO SANTANNA·Filed 2020·Granted Jan 3, 2023·0 cites·18 claims
- 1961US2024369540A1Mechanisms and predictors of adjuvanticity and antibody durabilityUNIV LELAND STANFORD JUNIOR·Filed 2022·Application pending·0 cites
- 2054US8854830B2Semiconductor package substrate in particular for MEMS devicesST MICROELECTRONICS SRL·Filed 2013·Granted Oct 7, 2014·0 cites·24 claims
- 2154US8411457B2Semiconductor package substrateZIGLIOLI FEDERICO·Filed 2009·Granted Apr 2, 2013·1 cites·14 claims
- 2251US8796059B2Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposedBALDO LORENZO·Filed 2012·Granted Aug 5, 2014·0 cites·12 claims
- 2346US12299610B2Optimized task generation and scheduling of automated guided carts using overhead sensor systemsAMAZON TECH INC·Filed 2022·Granted May 13, 2025·0 cites·19 claims
- 2443US8633583B2Semiconductor package substrate and methods for forming same, in particular for MEMS devicesZIGLIOLI FEDERICO GIOVANNI·Filed 2007·Granted Jan 21, 2014·0 cites·23 claims
- 2540US2013028450A1Lid, fabricating method thereof, and mems package made therebyUNIMICRON TECHNOLOGY CORP·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →