Inventor · disambiguated record
Federico Giovanni Ziglioli
Also filed as: ZIGLIOLI FEDERICO · ZIGLIOLI FEDERICO GIOVANNI
63 granted patents·8 pending applications·267 citations·filing 2006–2022
98Inventor score
Files withST MICROELECTRONICS SRL61ZIGLIOLI FEDERICO GIOVANNI5LEM INTERNATIONAL SA1SHAW MARK ANDREW1STMICROELETRONICS S R L1
Top patents by PatentIndex Score
71 records- 0196US10598578B2Tensile stress measurement device with attachment plates and related methodsST MICROELECTRONICS SRL·Filed 2017·Granted Mar 24, 2020·9 cites·22 claims
- 0296US7898043B2Package, in particular for MEMS devices and method of making sameST MICROELECTRONICS SRL·Filed 2008·Granted Mar 1, 2011·31 cites·34 claims
- 0395US12033926B2Method of manufacturing semiconductor devices with a paddle and electrically conductive clip and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2021·Granted Jul 9, 2024·2 cites·16 claims
- 0495US8499613B2Integrated chemical sensor for detecting odorous mattersZIGLIOLI FEDERICO GIOVANNI·Filed 2011·Granted Aug 6, 2013·28 cites·22 claims
- 0595US8049287B2Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated deviceST MICROELECTRONICS SRL·Filed 2008·Granted Nov 1, 2011·50 cites·67 claims
- 0694US9464952B2Integrated electronic device for monitoring mechanical stress within a solid structureST MICROELECTRONICS SRL·Filed 2013·Granted Oct 11, 2016·11 cites·27 claims
- 0793US10794783B2Pressure sensing device with cavity and related methodsST MICROELECTRONICS SRL·Filed 2018·Granted Oct 6, 2020·5 cites·29 claims
- 0892US8981498B2Electronic MEMS device comprising a chip bonded to a substrate and having cavities and manufacturing process thereofZIGLIOLI FEDERICO GIOVANNI·Filed 2012·Granted Mar 17, 2015·11 cites·17 claims
- 0991US9791303B2Package, made of building material, for a parameter monitoring device, within a solid structure, and relative deviceST MICROELECTRONICS SRL·Filed 2013·Granted Oct 17, 2017·10 cites·37 claims
- 1089US10424525B2Method of manufacturing semiconductor devicesST MICROELECTRONICS SRL·Filed 2018·Granted Sep 24, 2019·5 cites·24 claims
- 1188US11145582B2Method of manufacturing semiconductor devices with a paddle and electrically conductive clip connected to a leadframe and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2019·Granted Oct 12, 2021·4 cites·13 claims
- 1288US9859256B1Ink printed wire bondingST MICROELECTRONICS SRL·Filed 2016·Granted Jan 2, 2018·5 cites·16 claims
- 1387US9736925B2Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2015·Granted Aug 15, 2017·5 cites·21 claims
- 1487US9708174B2Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a MEMS microphone and packaged device obtained therebyST MICROELECTRONICS SRL·Filed 2014·Granted Jul 18, 2017·7 cites·25 claims
- 1586US8324007B2Manufacturing method of an electronic device including overmolded MEMS devicesZIGLIOLI FEDERICO GIOVANNI·Filed 2010·Granted Dec 4, 2012·5 cites·17 claims
- 1685US9939338B2Pressure sensing device with cavity and related methodsST MICROELECTRONICS SRL·Filed 2015·Granted Apr 10, 2018·3 cites·24 claims
- 1785US9761511B2Electronic components with integral lead frame and wiresST MICROELECTRONICS SRL·Filed 2015·Granted Sep 12, 2017·4 cites·25 claims
- 1885US9726587B2Tensile stress measurement device with attachment plates and related methodsST MICROELECTRONICS SRL·Filed 2015·Granted Aug 8, 2017·2 cites·38 claims
- 1985US9180451B2Fluidic cartridge for detecting chemicals in samples, in particular for performing biochemical analysesZIGLIOLI FEDERICO GIOVANNI·Filed 2011·Granted Nov 10, 2015·11 cites·18 claims
- 2084US10930581B2Semiconductor package with wettable flankST MICROELECTRONICS SRL·Filed 2016·Granted Feb 23, 2021·3 cites·16 claims
- 2183US9011776B2Packaged device exposed to environmental air and liquids and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2013·Granted Apr 21, 2015·6 cites·22 claims
- 2283US7616451B2Semiconductor package substrate and method, in particular for MEMS devicesST MICROELECTRONICS SRL·Filed 2006·Granted Nov 10, 2009·9 cites·28 claims
- 2381USRE46671ESubstrate-level assembly for an integrated device, manufacturing process thereof and related integrated deviceST MICROELECTRONICS SRL·Filed 2013·Granted Jan 16, 2018·5 cites·67 claims
- 2480US9096421B2Stacked assembly of a MEMS integrated device having a reduced thicknessST MICROELECTRONICS SRL·Filed 2013·Granted Aug 4, 2015·5 cites·20 claims
- 2579US9887165B2IC with insulating trench and related methodsST MICROELECTRONICS SRL·Filed 2014·Granted Feb 6, 2018·3 cites·22 claims
- 2677US10468344B2Method of manufacturing semiconductor devices and corresponding productST MICROELECTRONICS SRL·Filed 2018·Granted Nov 5, 2019·2 cites·19 claims
- 2777US7998774B2Package, in particular for MEMS devices and method of making sameST MICROELECTRONICS SRL·Filed 2010·Granted Aug 16, 2011·2 cites·14 claims
- 2876US10756005B2Semiconductor device, corresponding circuit and methodST MICROELECTRONICS SRL·Filed 2018·Granted Aug 25, 2020·2 cites·17 claims
- 2972US11808650B2Pressure sensing device with cavity and related methodsST MICROELECTRONICS SRL·Filed 2020·Granted Nov 7, 2023·0 cites·24 claims
- 3071US10818578B2Method of manufacturing semiconductor devices, corresponding device and circuitST MICROELECTRONICS SRL·Filed 2018·Granted Oct 27, 2020·1 cites·19 claims
- 3169US11842954B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Dec 12, 2023·0 cites·13 claims
- 3269US9318313B2Semiconductor structure with low-melting-temperature conductive regions, and method of repairing a semiconductor structureST MICROELECTRONICS SRL·Filed 2013·Granted Apr 19, 2016·2 cites·25 claims
- 3368US8978483B2Integrated electronic device for detecting a local parameter related to a force experienced in a predetermined direction, within a solid structureSTMICROELETRONICS S R L·Filed 2013·Granted Mar 17, 2015·3 cites·26 claims
- 3467US10770432B2ASICS face to face self assemblyST MICROELECTRONICS SRL·Filed 2018·Granted Sep 8, 2020·1 cites·16 claims
- 3567US9187310B2Wafer-level packaging of a MEMS integrated device and related manufacturing processST MICROELECTRONICS SRL·Filed 2013·Granted Nov 17, 2015·2 cites·21 claims
- 3667US8800391B2Piezo-resistive force sensor with bumps on membrane structureZHANG XUEREN·Filed 2007·Granted Aug 12, 2014·8 cites·24 claims
- 3764US11133242B2Method of manufacturing semiconductor devices, corresponding device and circuitST MICROELECTRONICS SRL·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 3863US12500150B2Semiconductor package with wettable flankST MICROELECTRONICS SRL·Filed 2021·Granted Dec 16, 2025·0 cites·20 claims
- 3963US8967000B2Planar electric board with pliable wings and system for sensing components along three coordinate axis of inner forces in a block made of a building materialST MICROELECTRONICS SRL·Filed 2013·Granted Mar 3, 2015·2 cites·23 claims
- 4061US11417590B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Aug 16, 2022·0 cites·21 claims
- 4160US10497655B2Methods, circuits and systems for a package structure having wireless lateral connectionsST MICROELECTRONICS SRL·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
- 4258US12196787B2Current transducerLEM INTERNATIONAL SA·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 4357US10861760B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2019·Granted Dec 8, 2020·0 cites·17 claims
- 4456US10964646B2IC with insulating trench and related methodsST MICROELECTRONICS SRL·Filed 2017·Granted Mar 30, 2021·0 cites·26 claims
- 4555US9922945B2Methods, circuits and systems for a package structure having wireless lateral connectionsST MICROELECTRONICS SRL·Filed 2015·Granted Mar 20, 2018·0 cites·19 claims
- 4655US9099453B2Methods, circuits and systems for a package structure having wireless lateral connectionsST MICROELECTRONICS SRL·Filed 2013·Granted Aug 4, 2015·0 cites·15 claims
- 4755US2009115008A1Manufacturing method of an electronic device including overmolded mems devicesST MICROELECTRONICS SRL·Filed 2008·Application pending·0 cites
- 4854US10483238B2Ink printed wire bondingST MICROELECTRONICS SRL·Filed 2017·Granted Nov 19, 2019·0 cites·20 claims
- 4954US8854830B2Semiconductor package substrate in particular for MEMS devicesST MICROELECTRONICS SRL·Filed 2013·Granted Oct 7, 2014·0 cites·24 claims
- 5054US8411457B2Semiconductor package substrateZIGLIOLI FEDERICO·Filed 2009·Granted Apr 2, 2013·1 cites·14 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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