Inventor · disambiguated record

Yih Ming Chai

Also filed as: CHAI YIH MING

1 granted patent·0 citations·filing 2008–2008

14Inventor score

Technology areasH10W

Files withMICRON TECHNOLOGY INC1

Top patents by PatentIndex Score

1 record

0148US7691680B2Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·0 cites·19 claims

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