Inventor · disambiguated record
Jon W. Brunner
Also filed as: BRUNNER JON · BRUNNER JON W
13 granted patents·4 pending applications·186 citations·filing 1994–2025
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0193US9502371B2Methods of forming wire interconnect structuresKULICKE & SOFFA IND INC·Filed 2013·Granted Nov 22, 2016·14 cites·21 claims
- 0290US5421503AFine pitch capillary bonding toolKULICKE & SOFFA INVESTMENTS·Filed 1994·Granted Jun 6, 1995·128 cites·11 claims
- 0383US9865560B2Methods of forming wire interconnect structuresKULICKE & SOFFA IND INC·Filed 2016·Granted Jan 9, 2018·3 cites·24 claims
- 0478US7320425B2Low-profile capillary for wire bondingKULICKE & SOFFA IND INC·Filed 2005·Granted Jan 22, 2008·8 cites·8 claims
- 0575US7411157B2Electronic flame-off electrode with ball-shaped tipKULICKE & SOFFA IND INC·Filed 2005·Granted Aug 12, 2008·6 cites·18 claims
- 0672US7004369B2Capillary with contained inner chamferKULICKE & SOFFA INVESTMENTS·Filed 2005·Granted Feb 28, 2006·6 cites·50 claims
- 0771US2024404986A1Methods of calibrating an ultrasonic characteristic on a wire bonding systemKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 0870US10153247B2Methods of forming wire interconnect structuresKULICKE & SOFFA IND INC·Filed 2017·Granted Dec 11, 2018·1 cites·24 claims
- 0969US12304009B2Methods of installing wire bonding tools on wire bonding systems, and related installation tools and systemsKULICKE & SOFFA IND INC·Filed 2022·Granted May 20, 2025·0 cites·11 claims
- 1069US6910612B2Capillary with contained inner chamferKULICKE & SOFFA INVESTMENTS·Filed 2003·Granted Jun 28, 2005·16 cites·41 claims
- 1167US12113043B2Methods of calibrating an ultrasonic characteristic on a wire bonding systemKULICKE & SOFFA IND INC·Filed 2022·Granted Oct 8, 2024·0 cites·22 claims
- 1267US9153554B2Methods of adjusting ultrasonic bonding energy on wire bonding machinesKULICKE & SOFFA IND INC·Filed 2013·Granted Oct 6, 2015·2 cites·21 claims
- 1367US2025222544A1Methods of installing wire bonding tools on wire bonding systems, and related installation tools and systemsKULICKE & SOFFA IND INC·Filed 2025·Application pending·0 cites
- 1463US7795557B2Electronic flame-off electrode with ball-shaped tipKULICKE & SOFFA IND INC·Filed 2008·Granted Sep 14, 2010·2 cites·15 claims
- 1549US7500591B2Low-profile capillary for wire bondingKULICKE & SOFFA IND INC·Filed 2007·Granted Mar 10, 2009·0 cites·14 claims
- 1638US2012074206A1Methods of forming wire bonds for wire loops and conductive bumpsQIN WEI·Filed 2011·Application pending·0 cites
- 1734US2006186179A1Apparatus and method for bonding wiresLEVINE LEE R·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →