Inventor · disambiguated record
Masaki Waki
Also filed as: WAKI MASAKI
15 granted patents·6 pending applications·1,244 citations·filing 1991–2022
94Inventor score
Top patents by PatentIndex Score
21 records- 0198US5656550AMethod of producing a semicondutor device having a lead portion with outer connecting terminalFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·366 cites·24 claims
- 0295US5463253ASemiconductor device having a plurality of chipsFUJITSU LTD·Filed 1991·Granted Oct 31, 1995·210 cites·52 claims
- 0394US6433418B1Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanismFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·178 cites·4 claims
- 0494US6060768ASemiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frameFUJITSU LTD·Filed 1997·Granted May 9, 2000·192 cites·12 claims
- 0592US6255740B1Semiconductor device having a lead portion with outer connecting terminalsFUJITSU LTD·Filed 1997·Granted Jul 3, 2001·122 cites·7 claims
- 0687US5530292ASemiconductor device having a plurality of chipsFUJITSU LTD·Filed 1992·Granted Jun 25, 1996·94 cites·7 claims
- 0764US5479051ASemiconductor device having a plurality of semiconductor chipsFUJITSU LTD·Filed 1993·Granted Dec 26, 1995·41 cites·17 claims
- 0862US12117373B2Testing apparatus of utility poleNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Oct 15, 2024·0 cites·8 claims
- 0949US5447888AProcess of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pinsFUJITSU LTD·Filed 1994·Granted Sep 5, 1995·17 cites·5 claims
- 1048US11922650B2Point cloud analysis device, estimation device, point cloud analysis method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Mar 5, 2024·0 cites·20 claims
- 1147US6716675B2Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frameFUJITSU LTD·Filed 2002·Granted Apr 6, 2004·5 cites·11 claims
- 1246US12124777B2Equipment state detection device, equipment state detection method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Oct 22, 2024·0 cites·4 claims
- 1346US2024352758A1Jig and laying methodsNIPPON TELEGRAPH & TELEPHONE·Filed 2021·Application pending·0 cites
- 1443US2022283309A1Ground height measurement method, ground height measuring device, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Application pending·0 cites
- 1542US2024118152A1Arithmetic logic unit, equipment management method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Application pending·0 cites
- 1642US2022237335A1Equipment state analysis device, equipment state analysis method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Application pending·0 cites
- 1740US2025095287A1Device, method and program that create 3d modelsNIPPON TELEGRAPH & TELEPHONE·Filed 2022·Application pending·0 cites
- 1840US2025095288A1Device, method and program that create 3d modelsNIPPON TELEGRAPH & TELEPHONE·Filed 2022·Application pending·0 cites
- 1939US5984699AMethod of fabricating a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Nov 16, 1999·8 cites·11 claims
- 2037US6080604ASemiconductor device having tab-leads and a fabrication method thereofFUJITSU LTD·Filed 1997·Granted Jun 27, 2000·6 cites·4 claims
- 2136US5701028ASemiconductor device having tab leadsFUJITSU LTD·Filed 1996·Granted Dec 23, 1997·5 cites·17 claims
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