Inventor · disambiguated record
Seiichi Orimo
Also filed as: ORIMO SEIICHI
12 granted patents·1 pending application·1,618 citations·filing 1996–2004
95Inventor score
Files withFUJITSU LTD12
Top patents by PatentIndex Score
13 records- 0199US6072239ADevice having resin package with projectionsFUJITSU LTD·Filed 1996·Granted Jun 6, 2000·241 cites·14 claims
- 0298US5656550AMethod of producing a semicondutor device having a lead portion with outer connecting terminalFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·366 cites·24 claims
- 0394US6433418B1Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanismFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·178 cites·4 claims
- 0494US6025650ASemiconductor device including a frame terminalFUJITSU LTD·Filed 1997·Granted Feb 15, 2000·220 cites·15 claims
- 0593US6159770AMethod and apparatus for fabricating semiconductor deviceFUJITSU LTD·Filed 1998·Granted Dec 12, 2000·212 cites·9 claims
- 0692US6255740B1Semiconductor device having a lead portion with outer connecting terminalsFUJITSU LTD·Filed 1997·Granted Jul 3, 2001·122 cites·7 claims
- 0787US6288444B1Semiconductor device and method of producing the sameFUJITSU LTD·Filed 1999·Granted Sep 11, 2001·80 cites·24 claims
- 0886US6333564B1Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodesFUJITSU LTD·Filed 1999·Granted Dec 25, 2001·87 cites·14 claims
- 0984US5930603AMethod for producing a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Jul 27, 1999·77 cites·10 claims
- 1056US6856017B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 1999·Granted Feb 15, 2005·13 cites·19 claims
- 1156US6094356ASemiconductor device and semiconductor device moduleFUJITSU LTD·Filed 1998·Granted Jul 25, 2000·21 cites·4 claims
- 1247US7144754B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 2004·Granted Dec 5, 2006·1 cites·7 claims
- 1338US2001052653A1Semiconductor device and method of producing the sameFiled 2001·Application pending·0 cites
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