Inventor · disambiguated record
Shingetsu Yamada
Also filed as: YAMADA SHINGETSU
10 granted patents·2 pending applications·189 citations·filing 1994–2011
90Inventor score
Top patents by PatentIndex Score
12 records- 0187US6797367B2Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring boardSONY CORP·Filed 2003·Granted Sep 28, 2004·37 cites·5 claims
- 0284US6228467B1Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrateMITSUBISHI PLASTICS INC·Filed 1999·Granted May 8, 2001·59 cites·12 claims
- 0383US8742432B2Metal substrate and light source deviceSATO YOSHIHITO·Filed 2011·Granted Jun 3, 2014·8 cites·10 claims
- 0479US6499217B1Method of manufacturing three-dimensional printed wiring boardMITSUBISHI PLASTICS INC·Filed 2000·Granted Dec 31, 2002·27 cites·6 claims
- 0573US6824884B2Heat resistant resin composition, a heat resistant film or sheet thereof and a laminate comprising the film or the sheet as a susbstrateMITSUBISHI PLASTICS INC·Filed 2001·Granted Nov 30, 2004·12 cites·5 claims
- 0670US7022399B2Semiconductor device integrated multilayer wiring boardMITSUBISHI PLASTICS INC·Filed 2003·Granted Apr 4, 2006·19 cites·7 claims
- 0764US8169129B2Metal laminated body, LED-mounted substrate, and white filmMATSUI JUN·Filed 2008·Granted May 1, 2012·3 cites·17 claims
- 0863US7334324B2Method of manufacturing multilayer wiring boardSONY CORP·Filed 2004·Granted Feb 26, 2008·8 cites·3 claims
- 0954US5441804AMagneto-optical recording medium and method for production thereofMITSUBISHI PLASTICS IND·Filed 1994·Granted Aug 15, 1995·16 cites·13 claims
- 1047US2008116611A1Method of Manufacturing Multilayer Wiring BoardSONY CORP·Filed 2007·Application pending·0 cites
- 1146US8044304B2Multilayer printed circuit boardMITSUBISHI PLASTICS INC·Filed 2006·Granted Oct 25, 2011·0 cites·8 claims
- 1246US2011042124A1Multilayer wiring substrate having cavity portionMITSUBISHI PLASTICS INC·Filed 2008·Application pending·0 cites
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