Inventor · disambiguated record
Gyu Seok Song
Also filed as: SONG GYU SEOK · SONG GYU-SUK
5 granted patents·5 pending applications·18 citations·filing 2004–2015
73Inventor score
Top patents by PatentIndex Score
10 records- 0176US8309219B2Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the sameHWANG YONG HA·Filed 2010·Granted Nov 13, 2012·7 cites·16 claims
- 0263US9240364B2Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor devicePARK BAEK SOUNG·Filed 2014·Granted Jan 19, 2016·2 cites·20 claims
- 0362US9169425B2Adhesive film and electronic device including the sameKIM HYE JIN·Filed 2012·Granted Oct 27, 2015·1 cites·13 claims
- 0460US7010412B1Method for calculating parameters in road design of S-type clothoid, complex clothoid and egg type clothoidSAMAN ENGINEERING CONSULTANTS·Filed 2004·Granted Mar 7, 2006·8 cites·10 claims
- 0553US2009075008A1Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the sameHWANG YONG HA·Filed 2008·Application pending·0 cites
- 0645US2016075920A1Adhesive film for semiconductor deviceSAMSUNG SDI CO LTD·Filed 2015·Application pending·0 cites
- 0743US9887382B2Thermosetting composition for organic light-emitting element filler and organic light-emitting element display device comprising sameCHEIL IND INC·Filed 2013·Granted Feb 6, 2018·0 cites·14 claims
- 0838US2012141786A1Adhesive film for semiconductor deviceUH DONG SEON·Filed 2011·Application pending·0 cites
- 0938US2008160300A1Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the sameHWANG YONG HA·Filed 2007·Application pending·0 cites
- 1034US2011159294A1Attach film composition for semiconductor assembly and attach film using the sameSONG GYU SEOK·Filed 2010·Application pending·0 cites
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