Inventor · disambiguated record
Jeng-Jen Li
Also filed as: LI JENG-JEN
11 granted patents·3 pending applications·59 citations·filing 2000–2016
85Inventor score
Top patents by PatentIndex Score
14 records- 0185US7405467B2Power module package structureCYNTEC CO LTD·Filed 2005·Granted Jul 29, 2008·15 cites·25 claims
- 0279US6383048B1Packaging method for organic polymer EL displaysIND TECH RES INST·Filed 2000·Granted May 7, 2002·36 cites·11 claims
- 0374US8619428B2Electronic package structureLEE HAN-HSIANG·Filed 2011·Granted Dec 31, 2013·4 cites·15 claims
- 0465US9536798B2Package structure and the method to fabricate thereofLU BAU-RU·Filed 2012·Granted Jan 3, 2017·2 cites·11 claims
- 0557US9484290B2Electronic system with a composite substrateCYNTEC CO LTD·Filed 2013·Granted Nov 1, 2016·1 cites·16 claims
- 0654US8253041B2Electronic element packaging moduleCHEN DA-JUNG·Filed 2010·Granted Aug 28, 2012·1 cites·25 claims
- 0747US10373894B2Package structure and the method to fabricate thereofCYNTEC CO LTD·Filed 2016·Granted Aug 6, 2019·0 cites·18 claims
- 0843US2012262074A1Driving circuit of light emitting diodes having at least one bypass circuit, and driving method thereofWANG WEI-CHENG·Filed 2012·Application pending·0 cites
- 0941US8547709B2Electronic system with a composite substrateLEE HAN-HSIANG·Filed 2010·Granted Oct 1, 2013·0 cites·19 claims
- 1040US2006284340A1Method for preventing the overflowing of molding compound during fabricating package deviceCYNTEC CO LTD·Filed 2005·Application pending·0 cites
- 1140US2006220188A1Package structure having mixed circuit and composite substrateCYNTEC CO LTD·Filed 2005·Application pending·0 cites
- 1239US9386686B2Metal core printed circuit board and electronic package structureHUANG CHI-FENG·Filed 2012·Granted Jul 5, 2016·0 cites·9 claims
- 1335US10636735B2Package structure and the method to fabricate thereofLU BAU RU·Filed 2011·Granted Apr 28, 2020·0 cites·12 claims
- 1434US10373930B2Package structure and the method to fabricate thereofLI JENG JEN·Filed 2012·Granted Aug 6, 2019·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →