Inventor · disambiguated record
Hye Young Heo
Also filed as: HEO HYE YOUNG
19 granted patents·3 pending applications·8 citations·filing 2018–2022
88Inventor score
Top patents by PatentIndex Score
22 records- 0184US11642752B2Porous polyurethane polishing pad and process for preparing the sameSK ENPULSE CO LTD·Filed 2018·Granted May 9, 2023·2 cites·6 claims
- 0284US11534888B2Polishing pad with improved fluidity of slurry and process for preparing sameSKC SOLMICS CO LTD·Filed 2019·Granted Dec 27, 2022·2 cites·11 claims
- 0380US11207757B2Composition for polishing pad, polishing pad and preparation method of semiconductor deviceSKC SOLMICS CO LTD·Filed 2020·Granted Dec 28, 2021·1 cites·20 claims
- 0472US11279825B2Composition for polishing pad, polishing pad and preparation method thereofSKC SOLMICS CO LTD·Filed 2019·Granted Mar 22, 2022·1 cites·13 claims
- 0570US11931856B2Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the sameSK ENPULSE CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·6 claims
- 0669US11766759B2Porous polyurethane polishing pad and process for producing the sameSK ENPULSE CO LTD·Filed 2019·Granted Sep 26, 2023·1 cites·14 claims
- 0769US11325222B2Porous polyurethane polishing pad and method for manufacturing sameSKC SOLMICS CO LTD·Filed 2018·Granted May 10, 2022·1 cites·11 claims
- 0862US2022203496A1Polishing pad, manufacturing method thereof, method for manufacturing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2021·Application pending·0 cites
- 0959US11298795B2Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·6 claims
- 1059US11267098B2Leakage-proof polishing pad and process for preparing the sameSKC SOLMICS CO LTD·Filed 2018·Granted Mar 8, 2022·0 cites·21 claims
- 1154US11548970B2Composition for a polishing pad, polishing pad, and process for preparing the sameSKC SOLMICS CO LTD·Filed 2019·Granted Jan 10, 2023·0 cites·20 claims
- 1253US12076832B2Polishing pad with improved crosslinking density and process for preparing the sameSKC SOLMICS CO LTD·Filed 2020·Granted Sep 3, 2024·0 cites·10 claims
- 1349US12162114B2Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·17 claims
- 1449US11951591B2Polishing pad, method for producing the same and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·10 claims
- 1549US2022288743A1Polishing pad, method for producing the same and method of fabricating semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1649US2023059394A1Polishing pad and method for manufacturing semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1748US11628535B2Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing padSKC SOLMICS CO LTD·Filed 2019·Granted Apr 18, 2023·0 cites·17 claims
- 1846US11000935B2Polishing pad that minimizes occurrence of defects and process for preparing the sameSKC SOLMICS CO LTD·Filed 2020·Granted May 11, 2021·0 cites·12 claims
- 1945US11571783B2Polishing pad having excellent airtightnessSKC SOLMICS CO LTD·Filed 2018·Granted Feb 7, 2023·0 cites·9 claims
- 2042US12479063B2Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing padENPULSE CO LTD·Filed 2019·Granted Nov 25, 2025·0 cites·9 claims
- 2142US11724356B2Porous polyurethane polishing pad and preparation method thereofSK ENPULSE CO LTD·Filed 2018·Granted Aug 15, 2023·0 cites·9 claims
- 2241US11772236B2Porous polishing pad and process for producing the same all feesSK ENPULSE CO LTD·Filed 2019·Granted Oct 3, 2023·0 cites·20 claims
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