Inventor · disambiguated record
Masafumi Kuramoto
Also filed as: KURAMOTO MASAFUMI
62 granted patents·1 pending application·240 citations·filing 2002–2023
98Inventor score
Top patents by PatentIndex Score
63 records- 0196US8575632B2Light-emitting device, method for manufacturing same, molded body and sealing memberKURAMOTO MASAFUMI·Filed 2006·Granted Nov 5, 2013·49 cites·27 claims
- 0293US6924596B2Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the sameNICHIA CORP·Filed 2002·Granted Aug 2, 2005·79 cites·5 claims
- 0391US9893250B1Light emitting device having silicone resin-based sealing memberNICHIA CORP·Filed 2016·Granted Feb 13, 2018·11 cites·15 claims
- 0488US9502624B2Resin molding, surface mounted light emitting apparatus and methods for manufacturing the sameKURAMOTO MASAFUMI·Filed 2006·Granted Nov 22, 2016·11 cites·54 claims
- 0586US7785715B2Curable composition and method of preparing same, light-shielding paste, light-shielding resin and method of forming same, light-emitting diode package and semiconductor deviceKANEKA CORP·Filed 2004·Granted Aug 31, 2010·27 cites·30 claims
- 0685US10686102B2Resin molding, surface mounted light emitting apparatus and methods for manufacturing the sameNICHIA CORP·Filed 2019·Granted Jun 16, 2020·2 cites·16 claims
- 0785US7527991B2Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the sameNICHIA CORP·Filed 2005·Granted May 5, 2009·12 cites·14 claims
- 0884US9634204B2Resin molding, surface mounted light emitting apparatus and methods for manufacturing the sameNICHIA CORP·Filed 2013·Granted Apr 25, 2017·4 cites·18 claims
- 0981US10941304B2Metal powder sintering paste and method of producing the same, and method of producing conductive materialNICHIA CORP·Filed 2017·Granted Mar 9, 2021·3 cites·25 claims
- 1080US12447528B2Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion moduleNICHIA CORP·Filed 2023·Granted Oct 21, 2025·0 cites·9 claims
- 1179US11739238B2Electrically conductive adhesive and electrically conductive materialNICHIA CORP·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1276US11652197B2Method for producing an electronic deviceNICHIA CORP·Filed 2021·Granted May 16, 2023·0 cites·13 claims
- 1376US8968608B2Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting deviceKURAMOTO MASAFUMI·Filed 2009·Granted Mar 3, 2015·4 cites·24 claims
- 1475US12125607B2Metal powder sintering paste and method of producing the same, and method of producing conductive materialNICHIA CORP·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1575US11631790B2Resin molding, surface mounted light emitting apparatus and methods for manufacturing the sameNICHIA CORP·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 1673US10971656B2Resin molding, surface mounted light emitting apparatus and methods for manufacturing the sameNICHIA CORP·Filed 2020·Granted Apr 6, 2021·0 cites·18 claims
- 1772US11752551B2Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion moduleNICHIA CORP·Filed 2021·Granted Sep 12, 2023·0 cites·13 claims
- 1872US10950770B2Method for producing an electronic deviceNICHIA CORP·Filed 2019·Granted Mar 16, 2021·0 cites·15 claims
- 1972US10090446B2Light emitting device and method for manufacturing the sameKURAMOTO MASAFUMI·Filed 2012·Granted Oct 2, 2018·3 cites·43 claims
- 2072US9331251B2Light emitting deviceNICHIA CORP·Filed 2014·Granted May 3, 2016·3 cites·21 claims
- 2171US7371462B2Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening productKANEKA CORP·Filed 2003·Granted May 13, 2008·22 cites·55 claims
- 2268US8883048B2Reflector for light-emitting device, and light-emitting deviceHASHIMOTO KAZUHIKO·Filed 2010·Granted Nov 11, 2014·3 cites·13 claims
- 2367US11634596B2Metal powder sintering paste and method of producing the same, and method of producing conductive materialNICHIA CORP·Filed 2021·Granted Apr 25, 2023·0 cites·9 claims
- 2467US11162004B2Electrically conductive adhesive and electrically conductive materialNICHIA CORP·Filed 2017·Granted Nov 2, 2021·0 cites·18 claims
- 2567US10488325B2Curable resin composition, method for producing curable resin composition, and method for measuring surface tackiness of viscoelastic materialDAICEL CORP·Filed 2017·Granted Nov 26, 2019·0 cites·11 claims
- 2666US11168865B2Light-emitting device and backlightNICHIA CORP·Filed 2017·Granted Nov 9, 2021·1 cites·20 claims
- 2766US10573795B2Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting deviceNICHIA CORP·Filed 2017·Granted Feb 25, 2020·0 cites·14 claims
- 2865US9362190B2Semiconductor element, semiconductor device including the same, and method for manufacturing semiconductor elementNICHIA CORP·Filed 2014·Granted Jun 7, 2016·1 cites·20 claims
- 2964US9502610B2Method for manufacturing light emitting deviceNICHIA CORP·Filed 2015·Granted Nov 22, 2016·1 cites·20 claims
- 3063US12105013B2Curable resin composition, method for producing curable resin composition, and method for measuring surface tackiness of viscoelastic materialNICHIA CORP·Filed 2019·Granted Oct 1, 2024·0 cites·20 claims
- 3161US10263161B2Resin molding, surface mounted light emitting apparatus and methods for manufacturing the sameNICHIA CORP·Filed 2018·Granted Apr 16, 2019·0 cites·14 claims
- 3260US8679898B2Semiconductor device and production method thereforKURAMOTO MASAFUMI·Filed 2010·Granted Mar 25, 2014·1 cites·22 claims
- 3360US8642392B2Semiconductor device and production method thereforKURAMOTO MASAFUMI·Filed 2010·Granted Feb 4, 2014·1 cites·19 claims
- 3459US9929318B2Resin molding, surface mounted light emitting apparatus and methods for manufacturing the sameNICHIA CORP·Filed 2017·Granted Mar 27, 2018·0 cites·14 claims
- 3558US12356773B2Wavelength conversion member, light emitting device, and method for producing wavelength conversion memberNICHIA CORP·Filed 2021·Granted Jul 8, 2025·0 cites·16 claims
- 3658US10593851B2Metal powder sintering paste, method for producing the same, and method for producing conductive materialNICHIA CORP·Filed 2018·Granted Mar 17, 2020·0 cites·19 claims
- 3758US8836130B2Light emitting semiconductor element bonded to a base by a silver coatingKURAMOTO MASAFUMI·Filed 2011·Granted Sep 16, 2014·1 cites·10 claims
- 3857US11114583B2Light emitting device encapsulated above electrodesNICHIA CORP·Filed 2019·Granted Sep 7, 2021·0 cites·22 claims
- 3956US12264272B2Fluorescent material composite particles, wavelength converting member, light emitting device, method for producing fluorescent material composite particles, and method for producing wavelength converting memberNICHIA CORP·Filed 2022·Granted Apr 1, 2025·0 cites·24 claims
- 4056US11643553B2Silicone resin composition and method of producing sameNICHIA CORP·Filed 2020·Granted May 9, 2023·0 cites·13 claims
- 4156US9034671B2Light-emitting device and method for manufacturing sameNICHIA CORP·Filed 2014·Granted May 19, 2015·0 cites·20 claims
- 4255US9812624B2Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting deviceNICHIA CORP·Filed 2015·Granted Nov 7, 2017·0 cites·21 claims
- 4355US8803159B2Light-emitting device and method for manufacturing sameNICHIA CORP·Filed 2013·Granted Aug 12, 2014·0 cites·15 claims
- 4453US9748455B2Semiconductor element, semiconductor device including the same, and method for manufacturing semiconductor elementNICHIA CORP·Filed 2016·Granted Aug 29, 2017·0 cites·26 claims
- 4553US9018664B2Semiconductor device and production method thereforNICHIA CORP·Filed 2013·Granted Apr 28, 2015·0 cites·16 claims
- 4653US8927341B2Semiconductor device and production method thereforNICHIA CORP·Filed 2014·Granted Jan 6, 2015·0 cites·14 claims
- 4752US9808970B2Light-emitting device, method for manufacturing same, and molded partNICHIA CORP·Filed 2013·Granted Nov 7, 2017·0 cites·8 claims
- 4852US9653662B2Light emitting deviceNICHIA CORP·Filed 2014·Granted May 16, 2017·0 cites·30 claims
- 4951US10535794B2Method for manufacturing light emitting device using a releasable base materialNICHIA CORP·Filed 2017·Granted Jan 14, 2020·0 cites·10 claims
- 5051US8900710B2Light-emitting device, method for manufacturing same, and molded partHAYASHI MASAKI·Filed 2008·Granted Dec 2, 2014·0 cites·16 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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