Inventor · disambiguated record
Hiroyuki Kiyomura
Also filed as: KIYOMURA HIROYUKI
7 granted patents·87 citations·filing 1997–2002
85Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD7
Top patents by PatentIndex Score
7 records- 0171US6902101B2Bump bonding method apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 7, 2005·15 cites·16 claims
- 0269US6474538B1Bonding apparatus and bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 5, 2002·16 cites·27 claims
- 0365US6467158B1Component feeder with load position alignment recognitionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 22, 2002·26 cites·1 claims
- 0450US6712111B2Bonding method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 30, 2004·4 cites·20 claims
- 0550US6647616B1Bump bonding unit with tray storage and transport apparatusesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 18, 2003·17 cites·3 claims
- 0645US6680221B2Bare chip mounting method and bare chip mounting systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 20, 2004·2 cites·20 claims
- 0736US6129203AIC discarding apparatus for flip chip mounting facilityMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Oct 10, 2000·7 cites·6 claims
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