Inventor · disambiguated record
Syu-Tang Liu
Also filed as: LIU SYU-TANG
14 granted patents·3 pending applications·1 citations·filing 2019–2025
83Inventor score
Files withADVANCED SEMICONDUCTOR ENG17
Top patents by PatentIndex Score
17 records- 0178US10741483B1Substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 11, 2020·1 cites·20 claims
- 0277US12249583B2Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Mar 11, 2025·0 cites·18 claims
- 0374US2025210544A1Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0472US12040261B2Substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 16, 2024·0 cites·6 claims
- 0565US11289411B2Substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 29, 2022·0 cites·19 claims
- 0664US11631734B2Vertical capacitor structure having capacitor in cavity, and method for manufacturing the vertical capacitor structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 18, 2023·0 cites·15 claims
- 0759US11728282B2Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 15, 2023·0 cites·15 claims
- 0857US10847602B2Vertical capacitor structure having capacitor in cavity and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 24, 2020·0 cites·18 claims
- 0956US11581123B2Inductor and circuit structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 14, 2023·0 cites·15 claims
- 1056US11508634B2Semiconductor package structure, electronic device, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·0 cites·18 claims
- 1153US11257742B2Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 22, 2022·0 cites·20 claims
- 1252US11107881B2Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layerADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 31, 2021·0 cites·8 claims
- 1351US2024429213A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1450US11621229B2Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 4, 2023·0 cites·19 claims
- 1550US2024421086A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1648US11894340B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 6, 2024·0 cites·10 claims
- 1748US11862585B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 2, 2024·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →