Inventor · disambiguated record
Chengdong Zhou
Also filed as: ZHOU CHENGDONG
9 granted patents·1 pending application·614 citations·filing 1995–2001
92Inventor score
Top patents by PatentIndex Score
10 records- 0196US6524461B2Electrodeposition of metals in small recesses using modulated electric fieldsFARADAY TECH MARKETING GROUP·Filed 2001·Granted Feb 25, 2003·76 cites·78 claims
- 0293US6319384B1Pulse reverse electrodeposition for metallization and planarization of semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 2000·Granted Nov 20, 2001·85 cites·24 claims
- 0393US6303014B1Electrodeposition of metals in small recesses using modulated electric fieldsFARADAY TECH MARKETING GROUP·Filed 2000·Granted Oct 16, 2001·98 cites·32 claims
- 0493US6210555B1Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse platingFARADAY TECH MARKETING GROUP·Filed 1999·Granted Apr 3, 2001·88 cites·44 claims
- 0591US6402931B1Electrochemical machining using modulated reverse electric fieldsFARADAY TECH MARKETING GROUP·Filed 1998·Granted Jun 11, 2002·86 cites·17 claims
- 0686US6203684B1Pulse reverse electrodeposition for metallization and planarization of a semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 1998·Granted Mar 20, 2001·86 cites·21 claims
- 0776US5599437AElectrolysis of electroactive species using pulsed currentFARADAY TECHNOLOGY INC·Filed 1995·Granted Feb 4, 1997·46 cites·27 claims
- 0870US5804057AMethod of removing metal salts from solution by electrolysis an electrode closely associated with an ion exchange resinFARADAY TECHNOLOGY INC·Filed 1996·Granted Sep 8, 1998·38 cites·14 claims
- 0967US6878259B2Pulse reverse electrodeposition for metallization and planarization of semiconductor substratesFARADAY TECH MARKETING GROUP·Filed 2001·Granted Apr 12, 2005·11 cites·24 claims
- 1025US2001054557A1Electroplating of metals using pulsed reverse current for control of hydrogen evolutionFiled 1997·Application pending·0 cites
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