Inventor · disambiguated record
David A. Sowatzke
Also filed as: SOWATZKE DAVID A
1 granted patent·3 pending applications·0 citations·filing 2010–2021
14Inventor score
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4 records- 0162US2021310145A1Plated Polymeric Article Including Tin/Copper Tie/Seed Layer3M INNOVATIVE PROPERTIES CO·Filed 2021·Application pending·0 cites
- 0259US11066753B2Plated polymeric article including tin/copper tie/seed layer3M INNOVATIVE PROPERTIES CO·Filed 2016·Granted Jul 20, 2021·0 cites·17 claims
- 0338US2012236528A1Multilayer emi shielding thin film with high rf permeabilityLE JOHN D·Filed 2010·Application pending·0 cites
- 0435US2010273093A1Catalyst particle size control with organic pigments3M INNOVATIVE PROPERTIES CO·Filed 2010·Application pending·0 cites
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