Inventor · disambiguated record
Aritharan Thurairajaratnam
Also filed as: THURAIRAJARATNAM ARITHARAN
27 granted patents·1 pending application·531 citations·filing 1998–2011
96Inventor score
Top patents by PatentIndex Score
28 records- 0194US6608376B1Integrated circuit package substrate with high density routing mechanismLSI LOGIC CORP·Filed 2002·Granted Aug 19, 2003·81 cites·21 claims
- 0292US5903050ASemiconductor package having capacitive extension spokes and method for making the sameLSI LOGIC CORP·Filed 1998·Granted May 11, 1999·181 cites·8 claims
- 0391US8889999B2Multiple layer printed circuit board with unplated viasTHURAIRAJARATNAM ARITHARAN·Filed 2011·Granted Nov 18, 2014·41 cites·21 claims
- 0489US6872321B2Direct positive image photo-resist transfer of substrate designLSI LOGIC CORP·Filed 2002·Granted Mar 29, 2005·43 cites·20 claims
- 0586US7081672B1Substrate via layout to improve bias humidity testing reliabilityLSI LOGIC CORP·Filed 2005·Granted Jul 25, 2006·15 cites·19 claims
- 0686US6531932B1Microstrip package having optimized signal line impedance controlLSI LOGIC CORP·Filed 2001·Granted Mar 11, 2003·23 cites·10 claims
- 0781US6496081B1Transmission equalization system and an integrated circuit package employing the sameLSI LOGIC CORP·Filed 2001·Granted Dec 17, 2002·23 cites·21 claims
- 0873US7791210B2Semiconductor package having discrete non-active electrical components incorporated into the packageLSI CORP·Filed 2003·Granted Sep 7, 2010·20 cites·16 claims
- 0973US6744130B1Isolated stripline structureLSI LOGIC CORP·Filed 2003·Granted Jun 1, 2004·18 cites·20 claims
- 1064US7829424B2Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designsLSI CORP·Filed 2008·Granted Nov 9, 2010·2 cites·3 claims
- 1163US6459049B1High density signal routingLSI LOGIC CORP·Filed 2001·Granted Oct 1, 2002·14 cites·16 claims
- 1259US7508062B2Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designsLSI CORP·Filed 2005·Granted Mar 24, 2009·1 cites·9 claims
- 1359US6396140B1Single reference plane plastic ball grid array packageLSI LOGIC CORP·Filed 2000·Granted May 28, 2002·8 cites·8 claims
- 1458US6791177B1Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrateLSI LOGIC CORP·Filed 2003·Granted Sep 14, 2004·8 cites·19 claims
- 1556US6946866B2Measurement of package interconnect impedance using tester and supporting testerLSI LOGIC CORP·Filed 2003·Granted Sep 20, 2005·7 cites·13 claims
- 1654US6555914B1Integrated circuit package viaLSI LOGIC CORP·Filed 2001·Granted Apr 29, 2003·7 cites·14 claims
- 1750US6566167B1PBGA electrical noise isolation of signal tracesLSI LOGIC CORP·Filed 2001·Granted May 20, 2003·4 cites·12 claims
- 1848US6825554B2PBGA electrical noise isolation of signal tracesLSI LOGIC CORP·Filed 2003·Granted Nov 30, 2004·3 cites·5 claims
- 1947US6225690B1Plastic ball grid array package with strip line configurationLSI LOGIC CORP·Filed 1999·Granted May 1, 2001·15 cites·11 claims
- 2046US6891392B2Substrate impedance measurementLSI LOGIC CORP·Filed 2003·Granted May 10, 2005·3 cites·20 claims
- 2145US6717423B1Substrate impedance measurementLSI LOGIC CORP·Filed 2002·Granted Apr 6, 2004·3 cites·20 claims
- 2243US6825066B2Stiffener designLSI LOGIC CORP·Filed 2002·Granted Nov 30, 2004·1 cites·20 claims
- 2342US6534968B1Integrated circuit test vehicleLSI LOGIC CORP·Filed 2001·Granted Mar 18, 2003·3 cites·20 claims
- 2441US7319272B2Ball assignment systemLSI LOGIC CORP·Filed 2005·Granted Jan 15, 2008·0 cites·20 claims
- 2540US6777803B2Solder mask on bonding ringLSI LOGIC CORP·Filed 2002·Granted Aug 17, 2004·1 cites·20 claims
- 2638US7024637B2Functionality based package design for integrated circuit blocksLSI LOGIC CORP·Filed 2003·Granted Apr 4, 2006·0 cites·12 claims
- 2737US6127728ASingle reference plane plastic ball grid array packageLSI LOGIC CORP·Filed 1999·Granted Oct 3, 2000·6 cites·1 claims
- 2836US2004070065A1Controlled impedance for wire bonding interconnectsFiled 2002·Application pending·0 cites
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