Inventor · disambiguated record
Shing-Chao Chen
Also filed as: CHEN SHING-CHAO
22 granted patents·2 pending applications·54 citations·filing 2014–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24
Top patents by PatentIndex Score
24 records- 0196US11177156B2Semiconductor package, manufacturing method of semiconductor device and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·10 cites·20 claims
- 0293US11088124B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 10, 2021·7 cites·20 claims
- 0392US9425178B2RDL-first packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·13 cites·20 claims
- 0491US10128193B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·8 cites·20 claims
- 0590US10515900B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 0690US2025349808A1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0788US10157846B2Method for forming chip package involving cutting processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
- 0887US11404381B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·20 claims
- 0987US10950572B2Die bonder and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·3 cites·20 claims
- 1086US12444719B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 1185US2025285905A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1282US12322640B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1382US10797038B2Semiconductor package and rework process for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 6, 2020·4 cites·20 claims
- 1481US12125797B2Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 1577US12080653B2Formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 1675US11776838B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1774US12033992B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 1866US10475764B2Die bonder and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 12, 2019·1 cites·20 claims
- 1963US10964663B2Die bonder and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 2056US10840111B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
- 2154US10867953B2Manufacturing method of integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 2252US9947552B2Structure and formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·19 claims
- 2351US10276537B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·13 claims
- 2449US10283470B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →