Inventor · disambiguated record
Insup Shin
Also filed as: SHIN INSUP
7 granted patents·2 pending applications·7 citations·filing 2013–2024
74Inventor score
Top patents by PatentIndex Score
9 records- 0188US10361177B2Semiconductor package having a molding layer including a molding cavity and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 23, 2019·6 cites·20 claims
- 0279US11721601B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·1 cites·21 claims
- 0354US9715437B2Pulsed-latch based razor with 1-cycle error recovery schemeIBM·Filed 2016·Granted Jul 25, 2017·0 cites·13 claims
- 0453US9292390B2Pulsed-latch based razor with 1-cycle error recovery schemeIBM·Filed 2013·Granted Mar 22, 2016·0 cites·11 claims
- 0553US9009545B2Pulsed-latch based razor with 1-cycle error recovery schemeIBM·Filed 2013·Granted Apr 14, 2015·0 cites·9 claims
- 0652US2024290754A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0752US2024321831A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0849US11756935B2Chip-stacked semiconductor package with increased package reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 0943US12230575B2Carrier structure including pockets for accommodating semiconductor chip stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
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