Inventor · disambiguated record
Vahid Goudarzi
Also filed as: GOUDARZI VAHID
7 granted patents·4 pending applications·15 citations·filing 2003–2013
78Inventor score
Files withMOTOROLA INC5GOUDARZI VAHID2LEIZEROVICH GUSTAVO D1MOTOROLA MOBILITY INC1MOTOROLA MOBILITY LLC1
Top patents by PatentIndex Score
11 records- 0164US9082766B2Method to enhance reliability of through mold via TMVA part on part POP devicesMOTOROLA MOBILITY LLC·Filed 2013·Granted Jul 14, 2015·2 cites·5 claims
- 0262US7413110B2Method for reducing stress between substrates of differing materialsMOTOROLA INC·Filed 2005·Granted Aug 19, 2008·3 cites·16 claims
- 0357US7903083B2Mixed-mode encapsulated electrophoretic display for electronic deviceMOTOROLA MOBILITY INC·Filed 2007·Granted Mar 8, 2011·1 cites·18 claims
- 0447US7132745B2Method for attaching shields on substratesMOTOROLA INC·Filed 2004·Granted Nov 7, 2006·4 cites·12 claims
- 0544US7167375B2Populated printed wiring board and method of manufactureMOTOROLA INC·Filed 2004·Granted Jan 23, 2007·2 cites·29 claims
- 0642US2006182939A1Method and arrangement forming a solder mask on a ceramic moduleMOTOROLA INC·Filed 2005·Application pending·0 cites
- 0740US7773224B2Spectrum verification imaging system and methodMOTOROLA INC·Filed 2007·Granted Aug 10, 2010·0 cites·20 claims
- 0838US2007023203A1Method and system for customized radio frequency shielding using solder bumpsLEIZEROVICH GUSTAVO D·Filed 2005·Application pending·0 cites
- 0936US2006021466A1Mixed alloy lead-free solder pasteGOUDARZI VAHID·Filed 2005·Application pending·0 cites
- 1035US8390126B2Method and arrangement for reduced thermal stress between substratesGOUDARZI VAHID·Filed 2003·Granted Mar 5, 2013·3 cites·14 claims
- 1132US2005074923A1Metallic dam and method of forming thereforFiled 2003·Application pending·0 cites
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