Inventor · disambiguated record
Martin Standing
Also filed as: STANDING MARTIN
88 granted patents·8 pending applications·982 citations·filing 2001–2023
99Inventor score
Files withINT RECTIFIER CORP33INFINEON TECHNOLOGIES AUSTRIA AG22STANDING MARTIN17INFINEON TECHNOLOGIES AMERICAS CORP13FARADAY SEMI INC3
Top patents by PatentIndex Score
96 records- 0199US11069624B2Electrical devices and methods of manufactureFARADAY SEMI INC·Filed 2020·Granted Jul 20, 2021·8 cites·32 claims
- 0298US11621230B2Electrical devices and methods of manufactureFARADAY SEMI INC·Filed 2021·Granted Apr 4, 2023·4 cites·9 claims
- 0398US6624522B2Chip scale surface mounted device and process of manufactureINT RECTIFIER CORP·Filed 2001·Granted Sep 23, 2003·214 cites·11 claims
- 0497US7045884B2Semiconductor device packageINT RECTIFIER CORP·Filed 2003·Granted May 16, 2006·123 cites·20 claims
- 0596US6677669B2Semiconductor package including two semiconductor die disposed within a common clipINT RECTIFIER CORP·Filed 2002·Granted Jan 13, 2004·112 cites·24 claims
- 0694US6890845B2Chip scale surface mounted device and process of manufactureINT RECTIFIER CORP·Filed 2004·Granted May 10, 2005·59 cites·24 claims
- 0794US6767820B2Chip scale surface mounted device and process of manufactureINT RECTIFIER CORP·Filed 2003·Granted Jul 27, 2004·65 cites·9 claims
- 0892US9070642B2Electronic moduleSTANDING MARTIN·Filed 2011·Granted Jun 30, 2015·15 cites·24 claims
- 0991US9837393B2Semiconductor package with integrated semiconductor devices and passive componentINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Dec 5, 2017·5 cites·18 claims
- 1091US7368325B2Semiconductor packageINT RECTIFIER CORP·Filed 2007·Granted May 6, 2008·12 cites·12 claims
- 1187US6582990B2Wafer level underfill and interconnect processINT RECTIFIER CORP·Filed 2002·Granted Jun 24, 2003·38 cites·19 claims
- 1286US9147644B2Semiconductor device and passive component integration in a semiconductor packageSTANDING MARTIN·Filed 2009·Granted Sep 29, 2015·9 cites·20 claims
- 1385US9281260B2Semiconductor packages and methods of forming the sameSTANDING MARTIN·Filed 2012·Granted Mar 8, 2016·7 cites·24 claims
- 1485US9054090B2Power semiconductor packageINT RECTIFIER CORP·Filed 2014·Granted Jun 9, 2015·4 cites·10 claims
- 1585US7466012B2Power semiconductor packageINT RECTIFIER CORP·Filed 2005·Granted Dec 16, 2008·12 cites·12 claims
- 1685US7230333B2Semiconductor packageINT RECTIFIER CORP·Filed 2006·Granted Jun 12, 2007·7 cites·8 claims
- 1784US7285866B2Surface mounted package with die bottom spaced from support boardINT RECTIFIER CORP·Filed 2005·Granted Oct 23, 2007·10 cites·25 claims
- 1884US6573122B2Wafer level insulation underfill for die attachINT RECTIFIER CORP·Filed 2002·Granted Jun 3, 2003·30 cites·16 claims
- 1983US7482681B2Semiconductor device package utilizing proud interconnect materialINT RECTIFIER CORP·Filed 2007·Granted Jan 27, 2009·9 cites·27 claims
- 2083USD503691SConductive clip for a semiconductor packageINT RECTIFIER CORP·Filed 2003·Granted Apr 5, 2005·33 cites·1 claims
- 2181US9496205B2Power semiconductor packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Nov 15, 2016·2 cites·16 claims
- 2281US9041187B2Power semiconductor package with multiple diesINT RECTIFIER CORP·Filed 2014·Granted May 26, 2015·3 cites·15 claims
- 2381US7402507B2Semiconductor package fabricationINT RECTIFIER CORP·Filed 2006·Granted Jul 22, 2008·12 cites·22 claims
- 2480US9595512B2Passive component integrated with semiconductor device in semiconductor packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Mar 14, 2017·2 cites·19 claims
- 2580US9496245B2Semiconductor package with integrated semiconductor devices and passive componentINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Nov 15, 2016·2 cites·20 claims
- 2680US8319334B2Embedded laminated deviceSTANDING MARTIN·Filed 2009·Granted Nov 27, 2012·7 cites·20 claims
- 2779US12199046B2Electrical devices and methods of manufactureFARADAY SEMI INC·Filed 2023·Granted Jan 14, 2025·0 cites·16 claims
- 2879US10064287B2System and method of providing a semiconductor carrier and redistribution structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Aug 28, 2018·5 cites·19 claims
- 2979US8786072B2Semiconductor packageSTANDING MARTIN·Filed 2008·Granted Jul 22, 2014·5 cites·13 claims
- 3079US7364949B2Semiconductor device packageINT RECTIFIER CORP·Filed 2006·Granted Apr 29, 2008·7 cites·5 claims
- 3178US7253090B2Chip scale surface mounted device and process of manufactureINT RECTIFIER CORP·Filed 2005·Granted Aug 7, 2007·5 cites·29 claims
- 3275US7476979B2Chip scale surface mounted device and process of manufactureINT RECTIFIER CORP·Filed 2006·Granted Jan 13, 2009·4 cites·20 claims
- 3375US6930397B2Surface mounted package with die bottom spaced from support boardINT RECTIFIER CORP·Filed 2002·Granted Aug 16, 2005·18 cites·14 claims
- 3474US7122887B2Chip scale surface mounted device and process of manufactureINT RECTIFIER CORP·Filed 2003·Granted Oct 17, 2006·13 cites·31 claims
- 3573US9418925B2Electronic component and method for electrically coupling a semiconductor die to a contact padINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Aug 16, 2016·3 cites·19 claims
- 3673US9391003B2Semiconductor package with conductive clipINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Jul 12, 2016·1 cites·10 claims
- 3773US9391004B2Power semiconductor package with conductive clip and related methodINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Jul 12, 2016·1 cites·15 claims
- 3873US6967412B2Wafer level underfill and interconnect processINT RECTIFIER CORP·Filed 2003·Granted Nov 22, 2005·15 cites·17 claims
- 3971US9048196B2Power semiconductor packageSTANDING MARTIN·Filed 2008·Granted Jun 2, 2015·4 cites·14 claims
- 4071US9041191B2Power semiconductor packageSTANDING MARTIN·Filed 2011·Granted May 26, 2015·1 cites·8 claims
- 4171US8061023B2Process of fabricating a semiconductor packageSTANDING MARTIN·Filed 2007·Granted Nov 22, 2011·2 cites·18 claims
- 4271US7315081B2Semiconductor device package utilizing proud interconnect materialINT RECTIFIER CORP·Filed 2004·Granted Jan 1, 2008·14 cites·20 claims
- 4369US9642289B2Power supply and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted May 2, 2017·1 cites·21 claims
- 4469US9084382B2Method of embedding an electronic component into an aperture of a substrateINFINEON TECHNOLOGIES AUSTRIA·Filed 2012·Granted Jul 14, 2015·1 cites·9 claims
- 4568US7592688B2Semiconductor packageINT RECTIFIER CORP·Filed 2007·Granted Sep 22, 2009·4 cites·15 claims
- 4666US10074616B2Chip protection envelope and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Sep 11, 2018·1 cites·26 claims
- 4766US8686554B2Vertically mountable semiconductor device packageSTANDING MARTIN·Filed 2008·Granted Apr 1, 2014·3 cites·15 claims
- 4866US8603858B2Method for manufacturing a semiconductor packageSTANDING MARTIN·Filed 2011·Granted Dec 10, 2013·2 cites·23 claims
- 4966US6841865B2Semiconductor device having clips for connecting to external elementsINT RECTIFIER CORP·Filed 2002·Granted Jan 11, 2005·13 cites·28 claims
- 5065US9974187B2Power in leadSTANDING MARTIN·Filed 2013·Granted May 15, 2018·1 cites·24 claims
Showing the top 50 of 96 patent records by PatentIndex Score.
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