Inventor · disambiguated record
Hsueh-Hao Shih
Also filed as: SHIH HSUEH H · SHIH HSUEH-HAO
21 granted patents·5 pending applications·186 citations·filing 1996–2019
95Inventor score
Files withUNITED MICROELECTRONICS CORP14MACRONIX INT CO LTD4MACRONIOX INTERNAT CO LTD1UNITED INTEGRATED CIRCUITS CORP1WANG WAI S1
Top patents by PatentIndex Score
26 records- 0192US9177909B2Semiconductor capacitorUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 3, 2015·15 cites·8 claims
- 0271US6319861B1Method of improving depositionUNITED MICROELECTRONICS CORP·Filed 2000·Granted Nov 20, 2001·14 cites·16 claims
- 0368US5959311AStructure of an antenna effect monitorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Sep 28, 1999·34 cites·10 claims
- 0464US10090308B1Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 2, 2018·2 cites·14 claims
- 0563US10340203B2Semiconductor structure with through silicon via and method for fabricating and testing the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 2, 2019·1 cites·7 claims
- 0660US6677255B1Method for removing fences without reduction of ONO film thicknessMACRONIOX INTERNAT CO LTD·Filed 2002·Granted Jan 13, 2004·9 cites·19 claims
- 0759US6221744B1Method for forming a gateUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 24, 2001·18 cites·5 claims
- 0856US10685907B2Semiconductor structure with through silicon via and method for fabricating and testing the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 16, 2020·0 cites·2 claims
- 0956US6001694AManufacturing method for integrated circuit dielectric layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 14, 1999·16 cites·12 claims
- 1051US5920782AMethod for improving hot carrier degradationUNITED MICROELECTRONICS CORP·Filed 1997·Granted Jul 6, 1999·16 cites·13 claims
- 1149US6824452B1Polishing pad and process of chemical mechanical use thereofMACRONIX INT CO LTD·Filed 2003·Granted Nov 30, 2004·4 cites·16 claims
- 1246US5883002AMethod of forming contact profile by improving TEOS/BPSG selectivity for manufacturing a semiconductor deviceWINBOND ELECTRONICS CORP·Filed 1996·Granted Mar 16, 1999·17 cites·9 claims
- 1345US6887757B2Method of manufacturing flash memoryMACRONIX INT CO LTD·Filed 2003·Granted May 3, 2005·2 cites·10 claims
- 1445US6180492B1Method of forming a liner for shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jan 30, 2001·12 cites·11 claims
- 1543US6248644B1Method of fabricating shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 19, 2001·10 cites·9 claims
- 1642US7314796B2Methods for reducing wordline sheet resistanceMACRONIX INT CO LTD·Filed 2004·Granted Jan 1, 2008·1 cites·35 claims
- 1742US6911374B2Fabrication method for shallow trench isolation regionMACRONIX INT CO LTD·Filed 2003·Granted Jun 28, 2005·1 cites·20 claims
- 1839US2006252267A1Topology-selective oxide CMPWANG WAI S·Filed 2005·Application pending·0 cites
- 1938US6121095AMethod for fabricating gate oxideUNITED INTEGRATED CIRCUITS CORP·Filed 1998·Granted Sep 19, 2000·8 cites·5 claims
- 2037US6281143B1Method of forming borderless contactUNITED MICROELECTRONICS CORP·Filed 1999·Granted Aug 28, 2001·6 cites·17 claims
- 2136US9653546B2Nanowire structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 16, 2017·0 cites·12 claims
- 2236USRE40113EMethod for fabricating gate oxideUNITED MICROELECTRONICS CORP·Filed 2002·Granted Feb 26, 2008·0 cites·5 claims
- 2335US2005084990A1Endpoint detection in manufacturing semiconductor deviceFiled 2003·Application pending·0 cites
- 2435US2005009337A1[metal silicide structure and method of forming the same]Filed 2003·Application pending·0 cites
- 2534US2004209467A1Method for reducing plasma related damagesFiled 2003·Application pending·0 cites
- 2630US2001014483A1Method of forming a gate oxide layerFiled 1998·Application pending·0 cites
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