Inventor · disambiguated record
Kwang-Seong Choi
Also filed as: CHOI KWANG S · CHOI KWANG-SEONG
35 granted patents·37 pending applications·201 citations·filing 2000–2025
96Inventor score
Files withKOREA ELECTRONICS TELECOMM24ELECTRONICS & TELECOMMUNICATIONS RES INST23CHOE JOONG-SEON4EOM YONG SUNG3YOUN CHUN-JU3
Top patents by PatentIndex Score
72 records- 0190US6395581B1BGA semiconductor package improving solder joint reliability and fabrication method thereofHYUNDAI ELECTRONICS IND·Filed 2000·Granted May 28, 2002·56 cites·12 claims
- 0289US7583869B2Electroabsorption duplexerKOREA ELECTRONICS TELECOMM·Filed 2006·Granted Sep 1, 2009·27 cites·21 claims
- 0388US10636761B2Method of fabricating a semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Apr 28, 2020·6 cites·11 claims
- 0488US7733207B2Vertically formed inductor and electronic device having the sameKOREA ELECTRONICS TELECOMM·Filed 2008·Granted Jun 8, 2010·18 cites·5 claims
- 0586US7331723B2Enhanced coplanar waveguide and optical communication module using the sameKOREA ELECTRONICS TELECOMM·Filed 2006·Granted Feb 19, 2008·20 cites·11 claims
- 0684US8693459B2Polarization division multiplexed optical orthogonal frequency division multiplexing transmitter and receiverYOUN CHUN JU·Filed 2010·Granted Apr 8, 2014·9 cites·9 claims
- 0783US9853010B2Method of fabricating a semiconductor packageELECTRONICS AND TELELCOMMUNICATIONS RES INSTITUTE·Filed 2015·Granted Dec 26, 2017·7 cites·15 claims
- 0881US8211745B2Method and structure for bonding flip chipEOM YONG SUNG·Filed 2010·Granted Jul 3, 2012·7 cites·20 claims
- 0980US7009716B2System for monitoring optical output/wavelengthKOREA ELECTRONICS TELECOMM·Filed 2004·Granted Mar 7, 2006·17 cites·18 claims
- 1077US8521040B2Optical orthogonal frequency division multiplexing receiver and optical signal receiving method thereofYOUN CHUN JU·Filed 2010·Granted Aug 27, 2013·4 cites·3 claims
- 1176US8030200B2Method for fabricating a semiconductor packageKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Oct 4, 2011·6 cites·14 claims
- 1274US9270381B2Method and apparatus for transmitting and receiving coherent optical OFDMYOUN CHUN JU·Filed 2011·Granted Feb 23, 2016·4 cites·11 claims
- 1373US2025154325A1Vanillic acid-based organic-inorganic compound, curable composition, and production method thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 1472US7553092B2Optical module and optical module packageKOREA ELECTRONICS TELECOMM·Filed 2006·Granted Jun 30, 2009·6 cites·17 claims
- 1571US2023391956A1Silyl ether isohexide-based organic-inorganic compound, method for preparing the same, and curable composition containing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 1669US11618109B2Wire for electric bondingELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Apr 4, 2023·0 cites·13 claims
- 1769US8044757B2Electronic device including LTCC inductorKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Oct 25, 2011·4 cites·10 claims
- 1869US2014318615A1Conductive composition, silicon solar cell including the same, and manufacturing method thereofKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 1966US7599624B2System and method for switching channels using tunable laser diodesKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Oct 6, 2009·3 cites·12 claims
- 2065US7298933B2Optical moduleKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Nov 20, 2007·2 cites·12 claims
- 2163US2012222738A1Conductive composition, silicon solar cell including the same, and manufacturing method thereofOH SOO YOUNG·Filed 2012·Application pending·0 cites
- 2263US2022402070A1Laser control structure and laser bonding method using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Application pending·0 cites
- 2361US12457833B2Electronic device and its repair methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2461US2021358885A1Laser bonding method and a semiconductor package including a bonding part and a bonding targetELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 2560US12349505B2Method of manufacturing electric deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 2660US2025062276A1Method for dipping adhesive materialELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 2759US9980393B2Pattern-forming method for forming a conductive circuit patternELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted May 22, 2018·0 cites·15 claims
- 2859US9538666B2Bonding structure of electronic equipmentELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2014·Granted Jan 3, 2017·1 cites·15 claims
- 2958US2021252620A1Transfer and bonding method using laserELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 3058US2013146342A1Pattern-forming composition and pattern-forming method using the sameEOM YONG SUNG·Filed 2012·Application pending·0 cites
- 3157US11107790B2Laser bonding methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Aug 31, 2021·0 cites·15 claims
- 3256US12206056B2Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materialsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 3356US8723292B2Silicon interposer including backside inductorBAE HYUN-CHEOL·Filed 2012·Granted May 13, 2014·1 cites·4 claims
- 3456US2024021570A1Bonding apparatusELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 3555US2023326810A1Microwave heating device and method for manufacturing semiconductor packaging using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 3654US7012939B2Wavelength stabilization module having light-receiving element array and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2003·Granted Mar 14, 2006·3 cites·10 claims
- 3752US11677060B2Method for transferring and bonding of devicesELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jun 13, 2023·0 cites·12 claims
- 3852US11488841B2Method for manufacturing semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted Nov 1, 2022·0 cites·15 claims
- 3952US9024511B2Impact-type piezoelectric micro power generatorKOREA ELECTRONICS TELECOMM·Filed 2013·Granted May 5, 2015·0 cites·16 claims
- 4051US2013308949A1Optical orthogonal frequency division multiple multiplexing receiver and optical signal receiving method thereofKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 4150US2010142115A1Buried capacitor, method of manufacturing the same, and method of changing capacitance thereofKOREA ELECTRONICS TELECOMM·Filed 2009·Application pending·0 cites
- 4250US2025282908A1Flux agent and semiconductor package including cured product thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 4349US2022077099A1Composition for conductive adhesive, semiconductor package comprising cured product thereof, and method of manufacturing semiconductor package using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 4447US9031421B2Measuring device and method of measuring signal transmission time difference thereofKOREA ELECTRONICS TELECOMM·Filed 2013·Granted May 12, 2015·0 cites·10 claims
- 4545US2008285978A1Optical hybrid moduleKOREA ELECTRONICS TELECOMM·Filed 2008·Application pending·0 cites
- 4644US9006037B2Methods of forming bump and semiconductor device with the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Apr 14, 2015·0 cites·14 claims
- 4744US8335200B2Device and method for separation/conversion of multiband signalCHUNG YONG DUCK·Filed 2008·Granted Dec 18, 2012·0 cites·18 claims
- 4844US2010073238A1Microstrip patch antenna with high gain and wide band characteristicsKOREA ELECTRONICS TELECOMM·Filed 2009·Application pending·0 cites
- 4943US2012240727A1Method of manufacturing solder powder having diameter of sub-micrometers or several micrometersEOM YONG SUNG·Filed 2012·Application pending·0 cites
- 5043US2013156362A1Core and optical waveguideKIM DUK JUN·Filed 2012·Application pending·0 cites
Showing the top 50 of 72 patent records by PatentIndex Score.
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