Inventor · disambiguated record
Kazunari Suzuki
Also filed as: SUZUKI KAZUNARI
69 granted patents·15 pending applications·1,676 citations·filing 1981–2023
99Inventor score
Top patents by PatentIndex Score
84 records- 0196US7869597B2Method and system for secure packet communicationIBM·Filed 2006·Granted Jan 11, 2011·71 cites·20 claims
- 0296US6291273B1Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 1996·Granted Sep 18, 2001·208 cites·18 claims
- 0396US5637913ALeadframe semiconductor integrated circuit device using the same and method of and process for fabricating the twoHITACHI LTD·Filed 1994·Granted Jun 10, 1997·96 cites·14 claims
- 0496US5378656ALeadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the sameHITACHI LTD·Filed 1993·Granted Jan 3, 1995·103 cites·23 claims
- 0594US4954818AMulti-window display control systemHITACHI LTD·Filed 1986·Granted Sep 4, 1990·107 cites·15 claims
- 0693US6596561B2Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufactureHITACHI LTD·Filed 2001·Granted Jul 22, 2003·65 cites·35 claims
- 0792US6853089B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Feb 8, 2005·83 cites·29 claims
- 0891US7015069B2Method of manufacturing a semiconductor device and a semiconductor deviceHITACHI YONEZAWA ELECTRONICS·Filed 2005·Granted Mar 21, 2006·22 cites·6 claims
- 0991US6372554B1Semiconductor integrated circuit device and method for production of the sameHITACHI LTD·Filed 1999·Granted Apr 16, 2002·135 cites·21 claims
- 1090US5714405ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Feb 3, 1998·98 cites·40 claims
- 1189US8300822B2System for secure packet communicationNAKAI SHINJI·Filed 2010·Granted Oct 30, 2012·16 cites·20 claims
- 1288US7605682B2Magnetic core type laminated inductorFDK CORP·Filed 2006·Granted Oct 20, 2009·17 cites·6 claims
- 1386US8274980B2Ethernet link aggregationSATO MASAKAZU·Filed 2009·Granted Sep 25, 2012·13 cites·12 claims
- 1485US5583375ASemiconductor device with lead structure within the planar area of the deviceHITACHI LTD·Filed 1992·Granted Dec 10, 1996·73 cites·39 claims
- 1584US5874773ALead frame having a supporting pad with a plurality of slits arranged to permit the flow of resin so as to prevent the occurrence of voidsHITACHI LTD·Filed 1997·Granted Feb 23, 1999·78 cites·12 claims
- 1682US6723583B2Method of manufacturing a semiconductor device using a moldRENESAS TECH CORP·Filed 2003·Granted Apr 20, 2004·25 cites·22 claims
- 1782US4803543ASemiconductor device and process for producing the sameHITACHI LTD·Filed 1981·Granted Feb 7, 1989·54 cites·22 claims
- 1881US7323788B2Semiconductor device and manufacturing method of themRENESAS TECH CORP·Filed 2007·Granted Jan 29, 2008·10 cites·13 claims
- 1981US4829468APrint control systemHITACHI LTD·Filed 1987·Granted May 9, 1989·71 cites·15 claims
- 2080US7943861B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2005·Granted May 17, 2011·10 cites·21 claims
- 2177US7541667B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2005·Granted Jun 2, 2009·6 cites·7 claims
- 2276US6960823B2Semiconductor device and method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2002·Granted Nov 1, 2005·18 cites·3 claims
- 2374US7759224B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Jul 20, 2010·4 cites·5 claims
- 2473US8448655B2Ultrasonic cleaning deviceSUZUKI KAZUNARI·Filed 2009·Granted May 28, 2013·3 cites·8 claims
- 2572US6916686B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jul 12, 2005·20 cites·17 claims
- 2672US6872597B2Method of manufacturing a semiconductor device and a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Mar 29, 2005·13 cites·15 claims
- 2768US9661494B2Control apparatus, control method, communication system and programNTT DOCOMO INC·Filed 2014·Granted May 23, 2017·3 cites·8 claims
- 2868US9237091B2System and method of load balancing for ethernet link aggregationSATO MASAKAZU·Filed 2012·Granted Jan 12, 2016·2 cites·15 claims
- 2968US7176060B2Integrated circuit card and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Feb 13, 2007·17 cites·12 claims
- 3068US7148081B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Dec 12, 2006·14 cites·9 claims
- 3165US8156646B2Method for manufacturing printed wiring boardIWAI TSUTOMU·Filed 2009·Granted Apr 17, 2012·4 cites·10 claims
- 3265US7247576B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jul 24, 2007·2 cites·4 claims
- 3365US6558980B2Plastic molded type semiconductor device and fabrication process thereofFiled 2001·Granted May 6, 2003·11 cites·8 claims
- 3465US6396142B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted May 28, 2002·21 cites·23 claims
- 3563US7466649B1Method for setting a value of waiting time for switchingIBM·Filed 2008·Granted Dec 16, 2008·3 cites·1 claims
- 3663US6441400B1Semiconductor device and method of fabricating the sameHITACHI LTD·Filed 2002·Granted Aug 27, 2002·10 cites·2 claims
- 3762US9313650B2Communications system, mobile communications device, transition control device, transition control method, and transition control programNTT DOCOMO INC·Filed 2013·Granted Apr 12, 2016·2 cites·10 claims
- 3861US9901962B2Ultrasonic cleaning apparatusSUZUKI KAZUNARI·Filed 2012·Granted Feb 27, 2018·1 cites·9 claims
- 3961US7647420B2Apparatus and method for controlling storage deviceIBM·Filed 2006·Granted Jan 12, 2010·2 cites·1 claims
- 4061US7199469B2Semiconductor device having stacked semiconductor chips sealed with a resin seal memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Apr 3, 2007·12 cites·4 claims
- 4161US6723020B2Planetary carrier and method of manufactureAISIN AW CO·Filed 2002·Granted Apr 20, 2004·4 cites·10 claims
- 4260USRE43443ELeadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the twoKAJIHARA YUJIRO·Filed 2001·Granted Jun 5, 2012·8 cites·26 claims
- 4359US7074844B2AdhesivesYAMAHA CORP·Filed 2003·Granted Jul 11, 2006·4 cites·33 claims
- 4459US2015083160A1Ultrasonic cleaning deviceKAIJO KK·Filed 2014·Application pending·0 cites
- 4558US6989334B2Manufacturing method of a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jan 24, 2006·6 cites·8 claims
- 4657US8960208B2Ultrasonic cleaning deviceKAIJO KK·Filed 2013·Granted Feb 24, 2015·0 cites·2 claims
- 4757US7869358B2Communication relay apparatus, information management system, and control method and program thereforIBM·Filed 2006·Granted Jan 11, 2011·1 cites·16 claims
- 4857US6943456B2Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Sep 13, 2005·6 cites·7 claims
- 4957US6803258B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Oct 12, 2004·5 cites·8 claims
- 5057US6340837B1Semiconductor device and method of fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 22, 2002·19 cites·15 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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