Inventor · disambiguated record
Hiroharu Inoue
Also filed as: INOUE HIROHARU
31 granted patents·26 pending applications·74 citations·filing 1986–2025
94Inventor score
Files withPANASONIC IP MAN CO LTD37NIPPON STEEL CORP5PANASONIC CORP5INOUE HIROHARU4TOSHIBA MATSUSHITA DISPLAY TEC3
Top patents by PatentIndex Score
57 records- 0191US11066548B2Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Jul 20, 2021·2 cites·10 claims
- 0284US10371612B2Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board materialPANASONIC IP MAN CO LTD·Filed 2016·Granted Aug 6, 2019·2 cites·11 claims
- 0384US7838576B2Poly (phenylene ether) resin composition, prepreg, and laminated sheetPANASONIC ELEC WORKS CO LTD·Filed 2008·Granted Nov 23, 2010·6 cites·19 claims
- 0481US12173151B2Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring boardPANASONIC IP MAN CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·12 claims
- 0580US7413791B2Poly (phenylene ether) resin composition, prepreg, and laminated sheetMATSUSHITA ELECTRIC WORKS LTD·Filed 2003·Granted Aug 19, 2008·15 cites·19 claims
- 0678US4845185ASoluble copolyimide from 9,9-bis (4-amino phenyl) fluoreneNIPPON STEEL CORP·Filed 1987·Granted Jul 4, 1989·24 cites·5 claims
- 0778US2025230279A1Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 0874US11905409B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2023·Granted Feb 20, 2024·0 cites·16 claims
- 0968US4820868AProcess for preparation of naphthalene-2,6-dicarboxylic acid dialkali metal saltsNIPPON STEEL CORP·Filed 1986·Granted Apr 11, 1989·9 cites·7 claims
- 1066US11866580B2Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jan 9, 2024·0 cites·11 claims
- 1166US2022243013A1Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1265US2018312683A1Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1363US2025108582A1Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 1462US11365274B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 21, 2022·0 cites·13 claims
- 1562US2023357558A1Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1661US2023331957A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1760US11945910B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·12 claims
- 1860US9736935B2Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring boardPANASONIC CORP·Filed 2014·Granted Aug 15, 2017·0 cites·9 claims
- 1959US12098257B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Sep 24, 2024·0 cites·15 claims
- 2059US2023323104A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 2159US2024368323A1Resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 2259US2023331944A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 2358US12122129B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Oct 22, 2024·0 cites·12 claims
- 2456US9516746B2Metal-clad laminate and printed wiring boardPANASONIC CORP·Filed 2012·Granted Dec 6, 2016·0 cites·5 claims
- 2555US9795030B2Metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 17, 2017·0 cites·9 claims
- 2655US9661749B2Metal-clad laminate and printed wiring boardPANASONIC CORP·Filed 2012·Granted May 23, 2017·0 cites·12 claims
- 2755US2023250282A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 2854US9585248B2Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·12 claims
- 2954US9102850B2Prepreg, metal-clad laminate, and printed wiring boardPANASONIC CORP·Filed 2014·Granted Aug 11, 2015·0 cites·8 claims
- 3054US2024190112A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 3153US2023257581A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 3250US11407869B2Prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 9, 2022·0 cites·9 claims
- 3350US9578734B2Prepreg, metal-clad laminate, and printed wiring boardPANASONIC CORP·Filed 2013·Granted Feb 21, 2017·0 cites·18 claims
- 3448US12275846B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·13 claims
- 3547US11059260B2Prepreg, metal-clad laminated board, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 13, 2021·0 cites·16 claims
- 3647US2020181403A1Poly(phenylene ether) resin composition, and prepreg, metal-clad laminate, and wiring board each obtained using samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 3746US11234329B2Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jan 25, 2022·0 cites·6 claims
- 3846US9894761B2Prepreg, metal-clad laminated plate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 13, 2018·0 cites·7 claims
- 3946US4794159AHeat-resistant polyamide from bis(4-aminophenyl)fluoreneNIPPON STEEL CORP·Filed 1987·Granted Dec 27, 1988·6 cites·4 claims
- 4046US2024239974A1Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 4144US10009997B2Metal-clad laminate and printed wiring boardINOUE HIROHARU·Filed 2012·Granted Jun 26, 2018·0 cites·11 claims
- 4244US2022259363A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 4343US5006631AAromatic polyester carbonate from diphenol mixtureNIPPON STEEL CORP·Filed 1989·Granted Apr 9, 1991·5 cites·12 claims
- 4443US4833214ASoluble heat-resistant aromatic polyamide terminated with aromatic amido moietiesNIPPON STEEL CORP·Filed 1986·Granted May 23, 1989·5 cites·9 claims
- 4543US2007182888A1Liquid crystal display deviceTOSHIBA MATSUSHITA DISPLAY TEC·Filed 2007·Application pending·0 cites
- 4642US10543661B2Metal foil with resin, and metal-clad laminate and circuit board using samePANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 28, 2020·0 cites·10 claims
- 4742US2024165922A1Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 4841US2016090457A1Prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 4940US2008055524A1Liquid crystal display deviceTOSHIBA MATSUSHITA DISPLAY TEC·Filed 2007·Application pending·0 cites
- 5039US2007221923A1Array substrate and method of manufacturing the sameTOSHIBA MATSUSHITA DISPLAY TEC·Filed 2007·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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