Inventor · disambiguated record
Tetsukazu Sugiya
Also filed as: SUGIYA TETSUKAZU
9 granted patents·26 citations·filing 2013–2019
83Inventor score
Files withDISCO CORP9
Top patents by PatentIndex Score
9 records- 0185US9716040B2Wafer processing method using adhesive tape to pick up device chipsDISCO CORP·Filed 2016·Granted Jul 25, 2017·6 cites·9 claims
- 0284US10366925B2Wafer processing methodDISCO CORP·Filed 2018·Granted Jul 30, 2019·4 cites·2 claims
- 0380US9238288B2Method for processing plate objectDISCO CORP·Filed 2013·Granted Jan 19, 2016·6 cites·3 claims
- 0476US10937697B2Method of processing a semiconductor wafer that involves cutting to form grooves along the dicing lines and grinding reverse side of the waferDISCO CORP·Filed 2019·Granted Mar 2, 2021·2 cites·10 claims
- 0576US10825678B2Wafer processing methodDISCO CORP·Filed 2019·Granted Nov 3, 2020·2 cites·10 claims
- 0674US9786509B2Wafer processing methodDISCO CORP·Filed 2015·Granted Oct 10, 2017·3 cites·1 claims
- 0772US10707129B2Processing method of waferDISCO CORP·Filed 2018·Granted Jul 7, 2020·2 cites·4 claims
- 0863US10312144B2Method of dividing a wafer by back grindingDISCO CORP·Filed 2017·Granted Jun 4, 2019·1 cites·10 claims
- 0937US9852949B2Wafer processing methodDISCO CORP·Filed 2016·Granted Dec 26, 2017·0 cites·4 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →