Inventor · disambiguated record
Meoung Whan Cho
Also filed as: CHO MEOUNG WHAN
26 granted patents·6 pending applications·39 citations·filing 1995–2022
93Inventor score
Files withCHO MEOUNG WHAN8THE GOODSYSTEM CORP6WAVESQUARE INC3YAO TAKAFUMI3TOHOKU TECHNO ARCH CO LTD2
Top patents by PatentIndex Score
32 records- 0179US7829207B2Manufacture method for ZnO based compound semiconductor crystal and ZnO based compound semiconductor substrateSTANLEY ELECTRIC CO LTD·Filed 2008·Granted Nov 9, 2010·5 cites·6 claims
- 0277US9184338B2Semiconductor device and method of manufacturing the sameCHO MEOUNG WHAN·Filed 2011·Granted Nov 10, 2015·4 cites·13 claims
- 0374US7829435B2Method for growth of GaN single crystal, method for preparation of GaN substrate, process for producing GaN-based element, and GaN-based elementTOHOKU TECHNO ARCH CO LTD·Filed 2009·Granted Nov 9, 2010·3 cites·2 claims
- 0473US7438762B2Manufacture method for ZnO based compound semiconductor crystal and ZnO based compound semiconductor substrateSTANLEY ELECTRIC CO LTD TOKYO·Filed 2006·Granted Oct 21, 2008·5 cites·8 claims
- 0571US12110446B2Composite material and heat dissipation part comprising the composite materialTHE GOODSYSTEM CORP·Filed 2022·Granted Oct 8, 2024·0 cites·12 claims
- 0665US9502603B2Vertically structured group III nitride semiconductor LED chip and method for manufacturing the sameCHO MEOUNG WHAN·Filed 2011·Granted Nov 22, 2016·1 cites·7 claims
- 0760US8216869B2Group III nitride semiconductor and a manufacturing method thereofYAO TAKAFUMI·Filed 2008·Granted Jul 10, 2012·1 cites·17 claims
- 0859US8963290B2Semiconductor device and manufacturing method thereforTOBA RYUICHI·Filed 2010·Granted Feb 24, 2015·1 cites·13 claims
- 0959US8962362B2Vertically structured group III nitride semiconductor LED chip and method for manufacturing the sameCHO MEOUNG WHAN·Filed 2009·Granted Feb 24, 2015·1 cites·5 claims
- 1055US12120852B2Composite material and heat dissipation partTHE GOODSYSTEM CORP·Filed 2022·Granted Oct 15, 2024·0 cites·19 claims
- 1155US9537053B2III nitride semiconductor device and method of manufacturing the sameBBSA LTD·Filed 2012·Granted Jan 3, 2017·1 cites·3 claims
- 1255US9012935B2Vertically structured group III nitride semiconductor LED chip and method for manufacturing the sameWAVESQUARE INC·Filed 2013·Granted Apr 21, 2015·0 cites·4 claims
- 1350US2008261378A1Method for Growth of Gan Single Crystal, Method for Preparation of Gan Substrate, Process for Producing Gan-Based Element, and Gan-Based ElementTOHOKU TECHNO ARCH CO LTD·Filed 2006·Application pending·0 cites
- 1449US7906409B2Device manufacturing methodCANON KK·Filed 2009·Granted Mar 15, 2011·0 cites·13 claims
- 1549US6664570B1P-type contact electrode device and light-emitting deviceNGK INSULATORS LTD·Filed 2000·Granted Dec 16, 2003·3 cites·4 claims
- 1648US11285701B2Heat sink plateTHE GOODSYSTEM CORP·Filed 2020·Granted Mar 29, 2022·0 cites·14 claims
- 1748US8124504B2Method for growth of GaN single crystal, method for preparation of GaN substrate, process for producing GaN-based element, and GaN-based elementYAO TAKAFUMI·Filed 2010·Granted Feb 28, 2012·0 cites·12 claims
- 1847US10777484B2Heat sink plateTHE GOODSYSTEM CORP·Filed 2018·Granted Sep 15, 2020·0 cites·8 claims
- 1946US11876030B2Clad material and method for producing sameDOWA HOLDINGS CO LTD·Filed 2018·Granted Jan 16, 2024·0 cites·19 claims
- 2046USD703863SLighting elementsWAVESQUARE INC·Filed 2013·Granted Apr 29, 2014·6 cites·1 claims
- 2143US2022068758A1Radiation boardTHE GOODSYSTEM CORP·Filed 2020·Application pending·0 cites
- 2242US8119499B2Semiconductor substrate fabrication by etching of a peeling layerYAO TAKAFUMI·Filed 2006·Granted Feb 21, 2012·0 cites·10 claims
- 2341USD711583SLighting elementCHO MEOUNG WHAN·Filed 2012·Granted Aug 19, 2014·4 cites·1 claims
- 2441US2014217457A1Light-emitting element chip and manufacturing method thereforCHO MEOUNG WHAN·Filed 2011·Application pending·0 cites
- 2538USD711581SLighting elementCHO MEOUNG WHAN·Filed 2012·Granted Aug 19, 2014·3 cites·1 claims
- 2638US2015187887A1Iii nitride semiconductor device and method of manufacturing the sameCHO MEOUNG WHAN·Filed 2012·Application pending·0 cites
- 2736US2018328677A1Heat-dissipating plate for high-power elementTHE GOODSYSTEM CORP·Filed 2016·Application pending·0 cites
- 2834US2002041148A1White LED and method for fabricating the sameFiled 2001·Application pending·0 cites
- 2930USD703862SLighting elementsWAVESQUARE INC·Filed 2013·Granted Apr 29, 2014·1 cites·1 claims
- 3028USD711582SLighting elementCHO MEOUNG WHAN·Filed 2012·Granted Aug 19, 2014·0 cites·1 claims
- 3124USD853977SHeat sink plateTHE GOODSYSTEM CO LTD·Filed 2017·Granted Jul 16, 2019·0 cites·1 claims
- 3223US5707892AMethod for fabricating a semiconductor laser diodeLG ELECTRONICS INC·Filed 1995·Granted Jan 13, 1998·0 cites·18 claims
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