Inventor · disambiguated record
Jui-Hsiang Hung
Also filed as: HUNG JUI-HSIANG
6 granted patents·4 pending applications·57 citations·filing 2000–2024
81Inventor score
Top patents by PatentIndex Score
10 records- 0178US6437447B1Dual-sided chip package without a die padSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 20, 2002·33 cites·12 claims
- 0264US2025145512A1Methods and apparatus for manufacturing a ribbonCORNING INC·Filed 2023·Application pending·0 cites
- 0361US7410835B2Method for fabricating semiconductor package with short-prevented lead frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Aug 12, 2008·2 cites·6 claims
- 0460US6680531B2Multi-chip semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jan 20, 2004·13 cites·12 claims
- 0557US2025074809A1Controlled cooling apparatus and methods providing preferential cooling or heating within a continuous glass ribbonCORNING INC·Filed 2022·Application pending·0 cites
- 0656US6979886B2Short-prevented lead frame and method for fabricating semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 27, 2005·7 cites·5 claims
- 0753US2024392570A1Roofing systemBMIC LLC·Filed 2024·Application pending·0 cites
- 0843US6806565B2Lead-frame-based semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Oct 19, 2004·2 cites·8 claims
- 0937US7008826B2Lead-frame-based semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 7, 2006·0 cites·11 claims
- 1035US2004217450A1Leadframe-based non-leaded semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Application pending·0 cites
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