Inventor · disambiguated record
Hiromi Tomiyama
Also filed as: TOMIYAMA HIROMI
6 granted patents·59 citations·filing 1995–2017
81Inventor score
Files withSHINKAWA KK6
Top patents by PatentIndex Score
6 records- 0177US10586781B2Bonding apparatus and method of estimating position of landing point of bonding toolSHINKAWA KK·Filed 2016·Granted Mar 10, 2020·3 cites·6 claims
- 0254US5576828ABonding wire detection methodSHINKAWA KK·Filed 1995·Granted Nov 19, 1996·22 cites·3 claims
- 0341US5818958AWire bend inspection method and apparatusSHINKAWA KK·Filed 1996·Granted Oct 6, 1998·11 cites·4 claims
- 0441US5772040AWorkpiece conveying apparatus used with workpiece inspection deviceSHINKAWA KK·Filed 1995·Granted Jun 30, 1998·12 cites·2 claims
- 0541US5583641ABonding wire height detection methodSHINKAWA KK·Filed 1995·Granted Dec 10, 1996·11 cites·1 claims
- 0640US10816322B2Bonding apparatus and method for detecting height of bonding targetSHINKAWA KK·Filed 2017·Granted Oct 27, 2020·0 cites·11 claims
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