Inventor · disambiguated record
Atsushi Furumoto
Also filed as: FURUMOTO ATSUSHI
18 granted patents·187 citations·filing 1999–2020
94Inventor score
Top patents by PatentIndex Score
18 records- 0196US8957557B2Drive apparatusYAMASAKI MASASHI·Filed 2010·Granted Feb 17, 2015·20 cites·20 claims
- 0295US8710705B2Drive apparatusYAMASAKI MASASHI·Filed 2011·Granted Apr 29, 2014·15 cites·7 claims
- 0395US8310121B2Electronic circuit-integrated motor drive and semiconductor moduleFUJITA TOSHIHIRO·Filed 2010·Granted Nov 13, 2012·34 cites·13 claims
- 0494US8304942B2Drive apparatus adapted to promote heat dissipation from electronic circuit integrated thereinYAMASAKI MASASHI·Filed 2010·Granted Nov 6, 2012·16 cites·49 claims
- 0593US9088195B2Drive apparatusYAMASAKI MASASHI·Filed 2010·Granted Jul 21, 2015·15 cites·18 claims
- 0692US9025336B2Linked semiconductor module unit and electronic circuit-integrated motor device using sameDENSO CORP·Filed 2013·Granted May 5, 2015·11 cites·5 claims
- 0789US8630095B2Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using sameMINATO HIDEKI·Filed 2010·Granted Jan 14, 2014·9 cites·12 claims
- 0888US8247937B2Semiconductor module and electronic circuit-integrated motor device using sameMINATO HIDEKI·Filed 2010·Granted Aug 21, 2012·11 cites·18 claims
- 0986US8299664B2Drive apparatus and semiconductor moduleIWAI AYAKO·Filed 2010·Granted Oct 30, 2012·14 cites·51 claims
- 1083US9000633B2Drive apparatus having a motor, a heat sink, and a plurality of semiconductor modulesYAMASAKI MASASHI·Filed 2010·Granted Apr 7, 2015·6 cites·15 claims
- 1181US8338998B2Electronic circuit-integrated motor apparatusYAMASAKI MASASHI·Filed 2010·Granted Dec 25, 2012·6 cites·31 claims
- 1267US9124155B2Drive apparatus including motorYAMASAKI MASASHI·Filed 2010·Granted Sep 1, 2015·5 cites·13 claims
- 1355US6273319B1Wave soldering method and system used for the methodDENSO CORP·Filed 1999·Granted Aug 14, 2001·16 cites·10 claims
- 1454US11696411B2Sleeve soldering device and method of producing electronic deviceDENSO CORP·Filed 2020·Granted Jul 4, 2023·0 cites·14 claims
- 1553US11090751B2Reflow device and method for manufacturing substrate using the reflow deviceDENSO CORP·Filed 2019·Granted Aug 17, 2021·0 cites·10 claims
- 1650US11618107B2Device for manufacturing electric component and method for manufacturing electric componentHAMANAKODENSO CO LTD·Filed 2020·Granted Apr 4, 2023·0 cites·9 claims
- 1739US6412682B2Wave soldering method and system used for the methodDENSO CORP·Filed 2001·Granted Jul 2, 2002·0 cites·11 claims
- 1839US6273317B1Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanismDENSO CORP·Filed 1999·Granted Aug 14, 2001·9 cites·19 claims
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