Inventor · disambiguated record
Takeo Uno
Also filed as: UNO TAKEO
9 granted patents·3 pending applications·26 citations·filing 2006–2021
82Inventor score
Top patents by PatentIndex Score
12 records- 0190US8342895B2Connector and metallic material for connectorFURUKAWA ELECTRIC CO LTD·Filed 2008·Granted Jan 1, 2013·11 cites·3 claims
- 0286US8557392B2Flexible copper clad laminateFUJISAWA SATOSHI·Filed 2009·Granted Oct 15, 2013·8 cites·5 claims
- 0379US9263814B2Metal material for electrical electronic componentYOSHIDA KAZUO·Filed 2008·Granted Feb 16, 2016·2 cites·17 claims
- 0478US8512873B2Surface treated copper foil and copper clad laminateFUJISAWA SATOSHI·Filed 2009·Granted Aug 20, 2013·4 cites·2 claims
- 0563US11680332B2Surface-treated copper foil, and copper-clad laminate and circuit board using sameFURUKAWA ELECTRIC CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·10 claims
- 0659US10701811B2Surface-treated copper foil, and copper-clad laminate and printed wiring board using sameFURUKAWA ELECTRIC CO LTD·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 0753US7946022B2Copper alloy for electronic machinery and tools and method of producing the sameFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted May 24, 2011·1 cites·6 claims
- 0850US2010233506A1Silver-coated composite material for movable contact and method for manufacturing the sameFURUKAWA ELECTRIC CO LTD·Filed 2008·Application pending·0 cites
- 0945US8674229B2Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrateUNO TAKEO·Filed 2009·Granted Mar 18, 2014·0 cites·15 claims
- 1037US8852754B2Surface-treated copper foil, method for producing same, and copper clad laminated boardFUJISAWA SATOSHI·Filed 2011·Granted Oct 7, 2014·0 cites·9 claims
- 1135US2012285734A1Roughened copper foil, method for producing same, copper clad laminated board, and printed circuit boardUNO TAKEO·Filed 2011·Application pending·0 cites
- 1233US2010221576A1Copper alloy strip material for electrical/electronic componentsMIHARA KUNITERU·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →