Inventor · disambiguated record
Huei-Wen Yang
Also filed as: YANG HUEI-WEN
10 granted patents·13 pending applications·69 citations·filing 1998–2025
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9IND TECH RES INST4TAIWAN SEMICONDUCTOR MFG2KAO CHIH-KUANG1LEE MING-CHIA1
Top patents by PatentIndex Score
23 records- 0188US6599385B1Manufacturing method of a multi-layer optical information recording carrierIND TECH RES INST·Filed 2000·Granted Jul 29, 2003·29 cites·16 claims
- 0286US9112004B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 18, 2015·7 cites·20 claims
- 0380US8653663B2Barrier layer for copper interconnectKAO CHIH-KUANG·Filed 2010·Granted Feb 18, 2014·7 cites·19 claims
- 0480US2024371746A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0579US12125782B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0678US2025357076A1Method and apparatus for preparing samples for imagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US6797090B2Production method of multi-layer information record carriersIND TECH RES INST·Filed 2002·Granted Sep 28, 2004·11 cites·12 claims
- 0874US10867903B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·20 claims
- 0970US11587863B2Semiconductor structure and method of forming semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 1068US2024038486A1Method and apparatus for preparing samples for imagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1165US6589706B1Preparation of cyanine dye for high density optical recording diskIND TECH RES INST·Filed 2000·Granted Jul 8, 2003·6 cites·17 claims
- 1262US7133735B2Experiment management system and method thereof in semiconductor manufacturing environmentTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 7, 2006·3 cites·23 claims
- 1358US2025300149A13dic packaging with efficient heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1458US2025357223A1Semiconductor structure with testline and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1554US2007134594A1Fluorescent dye and structure and manufacturing method of fluorescent storage media using thereofLEE MING-CHIA·Filed 2006·Application pending·0 cites
- 1650US2024038605A1Semiconductor structure with testline and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1742US2004126701A1Fluorescent dye and structure and manufacturing method of fluorescent storage media using thereofFiled 2003·Application pending·0 cites
- 1839US6093790AOrganic-soluble aromatic polyimides, organic solutions and preparation thereofNAT SCIENCE COUNCIL·Filed 1998·Granted Jul 25, 2000·5 cites·34 claims
- 1939US2004265753A1Manufacturing method of cover layer of optical information storage mediaFiled 2003·Application pending·0 cites
- 2037US2003068577A1Novel cyanine-TCNQ dye for high density data storage mediaFiled 2001·Application pending·0 cites
- 2135US2003185143A1Multi-layer rewriteable information storage mediumIND TECH RES INST·Filed 2002·Application pending·0 cites
- 2234US2005101688A1Polymeric material applicable for making data-recording layer or multi-layer recording mediumFiled 2004·Application pending·0 cites
- 2332US2002037474A1Memory Layer of high-density recordable optical recordingFiled 2000·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →