Inventor · disambiguated record
Bob Shih-Wei Kuo
Also filed as: KUO BOB SHIH-WEI
26 granted patents·639 citations·filing 2006–2016
97Inventor score
Top patents by PatentIndex Score
26 records- 0199US7842541B1Ultra thin package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·169 cites·19 claims
- 0297US7632753B1Wafer level package utilizing laser-activated dielectric materialAMKOR TECHNOLOGY INC·Filed 2007·Granted Dec 15, 2009·55 cites·25 claims
- 0396US9670445B1Microfluidics sensor package fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 6, 2017·32 cites·18 claims
- 0496US8535961B1Light emitting diode (LED) package and methodKUO BOB SHIH-WEI·Filed 2010·Granted Sep 17, 2013·41 cites·19 claims
- 0596US8536663B1Metal mesh lid MEMS package and methodKUO BOB SHIH-WEI·Filed 2011·Granted Sep 17, 2013·35 cites·20 claims
- 0696US8354747B1Conductive polymer lid for a sensor package and method thereforAMKOR TECHNOLOGY INC·Filed 2010·Granted Jan 15, 2013·22 cites·19 claims
- 0796US8115283B1Reversible top/bottom MEMS packageBOLOGNIA DAVID·Filed 2009·Granted Feb 14, 2012·93 cites·14 claims
- 0895US8030722B1Reversible top/bottom MEMS packageAMKOR TECHNOLOGY INC·Filed 2009·Granted Oct 4, 2011·58 cites·17 claims
- 0994US8017436B1Thin substrate fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2007·Granted Sep 13, 2011·33 cites·23 claims
- 1092US9013011B1Stacked and staggered die MEMS package and methodKUO BOB SHIH-WEI·Filed 2011·Granted Apr 21, 2015·18 cites·21 claims
- 1191US8680656B1Leadframe structure for concentrated photovoltaic receiver packageKUO BOB SHIH WEI·Filed 2009·Granted Mar 25, 2014·22 cites·20 claims
- 1290US8809677B1Molded light guide for concentrated photovoltaic receiver moduleKUO BOB SHIH-WEI·Filed 2010·Granted Aug 19, 2014·7 cites·16 claims
- 1388US9420378B1Top port MEMS microphone package and methodSYED AHMER RAZA·Filed 2010·Granted Aug 16, 2016·14 cites·20 claims
- 1484US9758372B1MEMS package with MEMS die, magnet, and window substrate fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 12, 2017·7 cites·30 claims
- 1581US7750250B1Blind via capture pad structureAMKOR TECHNOLOGY INC·Filed 2006·Granted Jul 6, 2010·8 cites·18 claims
- 1680US10327076B1Top port MEMS package and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Jun 18, 2019·3 cites·19 claims
- 1779US8217507B1Edge mount semiconductor packageGALLOWAY JESSE E·Filed 2010·Granted Jul 10, 2012·8 cites·20 claims
- 1873US9359191B2Reversible top/bottom MEMS packageAMKOR TECHNOLOGY INC·Filed 2015·Granted Jun 7, 2016·1 cites·25 claims
- 1973US8671565B1Blind via capture pad structure fabrication methodKUO BOB SHIH-WEI·Filed 2010·Granted Mar 18, 2014·3 cites·19 claims
- 2070US9162871B1Metal mesh lid MEMS package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 20, 2015·2 cites·20 claims
- 2170US8866002B1Through wafer via structures for concentrated photovoltaic cellsPYCROFT GARRY·Filed 2009·Granted Oct 21, 2014·4 cites·20 claims
- 2264US7915715B2System and method to provide RF shielding for a MEMS microphone packageAMKOR TECHNOLOGY INC·Filed 2008·Granted Mar 29, 2011·3 cites·17 claims
- 2363US8866004B1Frame interconnect for concentrated photovoltaic moduleKUO BOB SHIH-WEI·Filed 2009·Granted Oct 21, 2014·1 cites·17 claims
- 2460US9776855B2Reversible top/bottom MEMS packageAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 3, 2017·0 cites·20 claims
- 2554US8981537B2Reversible top/bottom MEMS packageBOLOGNIA DAVID·Filed 2012·Granted Mar 17, 2015·0 cites·20 claims
- 2629US8552517B1Conductive paste and mold for electrical connection of photovoltaic die to substrateSELLI GIUSEPPE·Filed 2010·Granted Oct 8, 2013·0 cites·20 claims
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