Inventor · disambiguated record
Kar Weng Yan
Also filed as: YAN KAR WENG
6 granted patents·1 pending application·0 citations·filing 2011–2021
63Inventor score
Top patents by PatentIndex Score
7 records- 0151US2014295013A1Apparatus for molding electronic componentHO SHU CHUEN·Filed 2014·Application pending·0 cites
- 0249US11955347B2Encapsulation process for double-sided cooled packagesASMPT SINGAPORE PTE LTD·Filed 2021·Granted Apr 9, 2024·0 cites·16 claims
- 0346US8794952B2Apparatus for molding electronic componentsHO SHU CHUEN·Filed 2011·Granted Aug 5, 2014·0 cites·4 claims
- 0444US11676937B2Flexible sinter tool for bonding semiconductor devicesASMPT SINGAPORE PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·18 claims
- 0542US11621181B2Dual-sided molding for encapsulating electronic devicesASMPT SINGAPORE PTE LTD·Filed 2020·Granted Apr 4, 2023·0 cites·17 claims
- 0640US8292613B2Runner system for supplying molding compoundHO SHU CHUEN·Filed 2011·Granted Oct 23, 2012·0 cites·11 claims
- 0734US11227779B2Apparatus and method for processing a semiconductor deviceASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Jan 18, 2022·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →