Inventor · disambiguated record
Chai Wei Heng
Also filed as: HENG CHAI WEI
4 granted patents·7 citations·filing 2008–2011
66Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0159US8067841B2Semiconductor devices having a resin with warpage compensated surfacesHENG CHAI WEI·Filed 2008·Granted Nov 29, 2011·3 cites·25 claims
- 0257US7674657B2Method of manufacture of encapsulated packageINFINEON TECHNOLOGIES AG·Filed 2008·Granted Mar 9, 2010·2 cites·15 claims
- 0352US8207601B2Electronic component and a method of fabricating an electronic componentLOW KHAI HUAT JEFFREY·Filed 2008·Granted Jun 26, 2012·2 cites·20 claims
- 0446US8377753B2Method of fabricating a semiconductor device having a resin with warpage compensated structuresINFINEON TECHNOLOGIES AG·Filed 2011·Granted Feb 19, 2013·0 cites·29 claims
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