Inventor · disambiguated record
Rajiv Ranade
Also filed as: RANADE RAJIV · RANADE RAJIV M
20 granted patents·2 pending applications·567 citations·filing 1997–2012
96Inventor score
Top patents by PatentIndex Score
22 records- 0193US6984529B2Fabrication process for a magnetic tunnel junction deviceIBM·Filed 2003·Granted Jan 10, 2006·106 cites·29 claims
- 0293US6284666B1Method of reducing RIE lag for deep trench silicon etchingIBM·Filed 2000·Granted Sep 4, 2001·87 cites·13 claims
- 0390US8367556B1Use of an organic planarizing mask for cutting a plurality of gate linesIBM·Filed 2011·Granted Feb 5, 2013·10 cites·23 claims
- 0490US6809005B2Method to fill deep trench structures with void-free polysilicon or siliconINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 26, 2004·51 cites·32 claims
- 0587US6743727B2Method of etching high aspect ratio openingsIBM·Filed 2001·Granted Jun 1, 2004·38 cites·20 claims
- 0686US8455366B1Use of an organic planarizing mask for cutting a plurality of gate linesFULLER NICHOLAS C M·Filed 2012·Granted Jun 4, 2013·7 cites·17 claims
- 0786US6544838B2Method of deep trench formation with improved profile control and surface areaINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 8, 2003·36 cites·30 claims
- 0886US6489249B1Elimination/reduction of black silicon in DT etchINFINEON TECHNOLOGIES AG·Filed 2000·Granted Dec 3, 2002·37 cites·12 claims
- 0983US6858441B2MRAM MTJ stack to conductive line alignment methodINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 22, 2005·37 cites·27 claims
- 1082US5891807AFormation of a bottle shaped trenchSIEMENS AG·Filed 1997·Granted Apr 6, 1999·63 cites·16 claims
- 1181US6605504B1Method of manufacturing circuit with buried strap including a linerINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 12, 2003·19 cites·11 claims
- 1278US7291285B2Method and system for line-dimension control of an etch processIBM·Filed 2005·Granted Nov 6, 2007·4 cites·26 claims
- 1372US6821900B2Method for dry etching deep trenches in a substrateINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 23, 2004·15 cites·30 claims
- 1471US6103585AMethod of forming deep trench capacitorsSIEMENS AG·Filed 1998·Granted Aug 15, 2000·39 cites·2 claims
- 1563US6709917B2Method to increase the etch rate and depth in high aspect ratio structureIBM·Filed 2002·Granted Mar 23, 2004·8 cites·18 claims
- 1658US7700378B2Method and system for line-dimension control of an etch processIBM·Filed 2007·Granted Apr 20, 2010·0 cites·10 claims
- 1756US7144769B2Method to achieve increased trench depth, independent of CD as defined by lithographyIBM·Filed 2004·Granted Dec 5, 2006·4 cites·5 claims
- 1849US7091081B2Method for patterning a semiconductor regionIBM·Filed 2004·Granted Aug 15, 2006·3 cites·30 claims
- 1947US6821864B2Method to achieve increased trench depth, independent of CD as defined by lithographyIBM·Filed 2002·Granted Nov 23, 2004·1 cites·8 claims
- 2046US6768155B2Circuit with buried strap including linerINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 27, 2004·2 cites·15 claims
- 2143US2008190446A1Control of dry clean process in wafer processingRANADE RAJIV M·Filed 2007·Application pending·0 cites
- 2236US2007056927A1Process and system for etching doped siliconTSOU LEN Y·Filed 2005·Application pending·0 cites
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