Inventor · disambiguated record
Tsuyoshi So
Also filed as: SO TSUYOSHI
24 granted patents·19 pending applications·148 citations·filing 2003–2022
94Inventor score
Top patents by PatentIndex Score
43 records- 0197US10321609B2Cooling system and method of cooling electronic deviceFUJITSU LTD·Filed 2017·Granted Jun 11, 2019·26 cites·8 claims
- 0295US10342164B2Rack mount-type information processing apparatus and rack mount-type information processing systemFUJITSU LTD·Filed 2017·Granted Jul 2, 2019·16 cites·14 claims
- 0392US9778709B2Evaporator, cooling device, and electronic apparatusFUJITSU LTD·Filed 2015·Granted Oct 3, 2017·6 cites·13 claims
- 0489US10718554B2Manifold and information processing apparatusFUJITSU LTD·Filed 2017·Granted Jul 21, 2020·3 cites·16 claims
- 0587US7428154B2Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit boardFUJITSU LTD·Filed 2003·Granted Sep 23, 2008·50 cites·15 claims
- 0685US7838987B2Electronic device, standoff member, and method of manufacturing electronic deviceFUJITSU LTD·Filed 2005·Granted Nov 23, 2010·14 cites·14 claims
- 0783US9854710B2Information processing device and container for data centerFUJITSU LTD·Filed 2016·Granted Dec 26, 2017·3 cites·20 claims
- 0878US11064631B2Liquid immersion cooling device and information processing apparatusFUJITSU LTD·Filed 2018·Granted Jul 13, 2021·2 cites·11 claims
- 0978US7999374B2Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the sameFUJITSU LTD·Filed 2009·Granted Aug 16, 2011·7 cites·9 claims
- 1069US9951999B2Cooling device and electronic equipmentFUJITSU LTD·Filed 2014·Granted Apr 24, 2018·2 cites·9 claims
- 1169US7834443B2Semiconductor device with molten metal preventing memberFUJITSU LTD·Filed 2008·Granted Nov 16, 2010·4 cites·9 claims
- 1268US8264850B2Electronic device package with connection terminals including uneven contact surfacesSO TSUYOSHI·Filed 2009·Granted Sep 11, 2012·4 cites·8 claims
- 1368US2022078946A1Information processing device and electronic device cooling methodFUJITSU LTD·Filed 2021·Application pending·0 cites
- 1464US7872875B2Mounting board, height adjusting apparatus and mounting methodFUJITSU LTD·Filed 2007·Granted Jan 18, 2011·2 cites·7 claims
- 1559US7144762B2Semiconductor device with pins and method of assembling the semiconductor deviceFUJITSU LTD·Filed 2004·Granted Dec 5, 2006·9 cites·6 claims
- 1657US2014071631A1Printed circuit board unitFUJITSU LTD·Filed 2013·Application pending·0 cites
- 1755US2018177079A1Information processing device and electronic device cooling methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 1853US2015068702A1Dew condensation detecting device, cooling system and cooling medium flow rate controlling methodFUJITSU LTD·Filed 2014·Application pending·0 cites
- 1953US2023063990A1Semiconductor apparatus, socket, and electronic apparatusFUJITSU LTD·Filed 2022·Application pending·0 cites
- 2051US11497120B2Electronic card, method of manufacturing electronic card, and electronic apparatusFUJITSU LTD·Filed 2020·Granted Nov 8, 2022·0 cites·16 claims
- 2150US2015009620A1Electronic apparatusFUJITSU LTD·Filed 2014·Application pending·0 cites
- 2250US2010226102A1Printed circuit board unitFUJITSU LTD·Filed 2010·Application pending·0 cites
- 2348US11032936B2Information processing device and board deviceFUJITSU LTD·Filed 2019·Granted Jun 8, 2021·0 cites·9 claims
- 2448US10165706B2Liquid immersion bath and liquid immersion cooling apparatusFUJITSU LTD·Filed 2017·Granted Dec 25, 2018·0 cites·14 claims
- 2546US8421219B2Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the sameSO TSUYOSHI·Filed 2011·Granted Apr 16, 2013·0 cites·6 claims
- 2646US8309888B2Electronic apparatus, power control device for controlling a heater, and method of controlling power control deviceSO TSUYOSHI·Filed 2010·Granted Nov 13, 2012·0 cites·11 claims
- 2746US2018135920A1Heat exchanger, information processing device, and flat tube manufacturing methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 2845US10607917B2SubstrateFUJITSU LTD·Filed 2019·Granted Mar 31, 2020·0 cites·10 claims
- 2945US2015092347A1Cooling device, electronic apparatus and method of attaching cooling deviceFUJITSU LTD·Filed 2014·Application pending·0 cites
- 3045US2015250075A1Cooler and electronic deviceFUJITSU LTD·Filed 2014·Application pending·0 cites
- 3144US9694433B2Method of joining cooling componentFUJITSU LTD·Filed 2016·Granted Jul 4, 2017·0 cites·4 claims
- 3244US8709197B2Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic componentSO TSUYOSHI·Filed 2008·Granted Apr 29, 2014·0 cites·3 claims
- 3344US2019094928A1Information processing apparatusFUJITSU LTD·Filed 2018·Application pending·0 cites
- 3444US2015055301A1Card-type electronic component cooling structure and electronic deviceFUJITSU LTD·Filed 2014·Application pending·0 cites
- 3544US2015062827A1Heat sink and substrate unitFUJITSU LTD·Filed 2014·Application pending·0 cites
- 3643US2019150321A1Device for cooling electronic componentsFUJITSU LTD·Filed 2018·Application pending·0 cites
- 3743US2012216992A1Dew-condensation detecting apparatus, electronic equipment cooling system, and dew-condensation detecting methodSO TSUYOSHI·Filed 2011·Application pending·0 cites
- 3842US2014239488A1Electronic component unit and fixing structureFUJITSU LTD·Filed 2014·Application pending·0 cites
- 3941US2016309620A1Pump, cooling apparatus and electronic deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
- 4041US2012210776A1Condensation sensing device, electronic apparatus, and condensation sensing methodSO TSUYOSHI·Filed 2012·Application pending·0 cites
- 4140US10701834B2Information processing apparatusFUJITSU LTD·Filed 2018·Granted Jun 30, 2020·0 cites·3 claims
- 4240US9949402B2Liquid loop cooling apparatus, electronic instrument, and method for manufacturing liquid loop cooling apparatusFUJITSU LTD·Filed 2016·Granted Apr 17, 2018·0 cites·16 claims
- 4334US2016327996A1Cooling module and electronic deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →