Inventor · disambiguated record
Tinghao Wang
Also filed as: WANG TINGHAO · WANG TINGHAO F · WANG TINGHAO FRANK
8 granted patents·4 pending applications·29 citations·filing 1999–2019
82Inventor score
Top patents by PatentIndex Score
12 records- 0185US11264249B2Carbon containing hardmask removal process using sulfur containing process gasMATTSON TECH INC·Filed 2019·Granted Mar 1, 2022·4 cites·18 claims
- 0279US8207466B2Multi-position pushbutton with integral LED and actuatorSINGH NEERAJ·Filed 2008·Granted Jun 26, 2012·13 cites·30 claims
- 0372US8801947B2Methods for forming microlensesMATTSON TECH INC·Filed 2013·Granted Aug 12, 2014·4 cites·20 claims
- 0470US11195704B2Pedestal assembly for plasma processing apparatusMATTSON TECH INC·Filed 2018·Granted Dec 7, 2021·1 cites·11 claims
- 0555US6919272B2Method for patterning densely packed metal segments in a semiconductor die and related structureNEWPORT FAB LLC·Filed 2003·Granted Jul 19, 2005·5 cites·9 claims
- 0645US7709949B2Densely packed metal segments patterned in a semiconductor dieNEWPORT FAB LLC·Filed 2005·Granted May 4, 2010·0 cites·10 claims
- 0743US7268038B2Method for fabricating a MIM capacitor having increased capacitance density and related structureNEWPORT FAB LLC·Filed 2004·Granted Sep 11, 2007·2 cites·14 claims
- 0839US2020258718A1Gas Supply With Angled Injectors In Plasma Processing ApparatusMATTSON TECH INC·Filed 2019·Application pending·0 cites
- 0938US2002142596A1Method for selectively etching silicon and/or metal silicidesCYPRESS SEMICONDUCTOR CORP·Filed 2002·Application pending·0 cites
- 1038US2002090817A1Method for selectively etching silicon and/or metal silicidesCYPRESS SEMICONDUCTOR CORP·Filed 2002·Application pending·0 cites
- 1129US6890860B1Method for etching and/or patterning a silicon-containing layerCYPRESS SEMICONDUCTOR CORP·Filed 1999·Granted May 10, 2005·0 cites·20 claims
- 1225US2002132478A1Method for selectively etching silicon and/or metal silicidesFiled 1999·Application pending·0 cites
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