Inventor · disambiguated record
Valery M. Dubin
Also filed as: DUBIN VALERY · DUBIN VALERY M
114 granted patents·38 pending applications·8,372 citations·filing 1996–2021
99Inventor score
Files withINTEL CORP84DUBIN VALERY M14ADVANCED MICRO DEVICES INC13CORNELL RES FOUNDATION INC5DUBIN VALERY4
Top patents by PatentIndex Score
152 records- 0199US6077780AMethod for filling high aspect ratio openings of an integrated circuit to minimize electromigration failureADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 20, 2000·403 cites·15 claims
- 0299US5969422APlated copper interconnect structureADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 19, 1999·821 cites·37 claims
- 0399US5913147AMethod for fabricating copper-aluminum metallizationADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 15, 1999·497 cites·13 claims
- 0498US6359328B1Methods for making interconnects and diffusion barriers in integrated circuitsINTEL CORP·Filed 1998·Granted Mar 19, 2002·311 cites·20 claims
- 0598US5972192APulse electroplating copper or copper alloysADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 26, 1999·381 cites·16 claims
- 0698US5891513AElectroless CU deposition on a barrier layer by CU contact displacement for ULSI applicationsCORNELL RES FOUNDATION INC·Filed 1996·Granted Apr 6, 1999·582 cites·25 claims
- 0798US5674787ASelective electroless copper deposited interconnect plugs for ULSI applicationsSEMATECH INC·Filed 1996·Granted Oct 7, 1997·838 cites·32 claims
- 0897US8933473B1Method, apparatus and system for providing light source structures on a flexible substrateDUBIN VALERY·Filed 2012·Granted Jan 13, 2015·57 cites·30 claims
- 0997US7964174B2Nanotube growth and device formationINTEL CORP·Filed 2008·Granted Jun 21, 2011·29 cites·11 claims
- 1097US6645567B2Electroless plating bath composition and method of usingINTEL CORP·Filed 2001·Granted Nov 11, 2003·85 cites·15 claims
- 1197US5830805AElectroless deposition equipment or apparatus and method of performing electroless depositionCORNELL RES FOUNDATION INC·Filed 1996·Granted Nov 3, 1998·358 cites·15 claims
- 1297US5824599AProtected encapsulation of catalytic layer for electroless copper interconnectCORNELL RES FOUNDATION INC·Filed 1996·Granted Oct 20, 1998·561 cites·22 claims
- 1397US5695810AUse of cobalt tungsten phosphide as a barrier material for copper metallizationCORNELL RES FOUNDATION INC·Filed 1996·Granted Dec 9, 1997·833 cites·21 claims
- 1496US7348675B2Microcircuit fabrication and interconnectionINTEL CORP·Filed 2005·Granted Mar 25, 2008·35 cites·7 claims
- 1596US7262504B2Multiple stage electroless deposition of a metal layerINTEL CORP·Filed 2005·Granted Aug 28, 2007·26 cites·8 claims
- 1696US6249055B1Self-encapsulated copper metallizationADVANCED MICRO DEVICES INC·Filed 1998·Granted Jun 19, 2001·212 cites·2 claims
- 1796US6065424AElectroless deposition of metal films with spray processorCORNELL RES FOUNDATION INC·Filed 1996·Granted May 23, 2000·457 cites·9 claims
- 1896US5882498AMethod for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrateADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 16, 1999·162 cites·21 claims
- 1994US7470620B2Microcircuit fabrication and interconnectionINTEL CORP·Filed 2008·Granted Dec 30, 2008·26 cites·6 claims
- 2094US7285494B2Multiple stage electroless deposition of a metal layerINTEL CORP·Filed 2005·Granted Oct 23, 2007·19 cites·7 claims
- 2194US6958547B2Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugsINTEL CORP·Filed 2003·Granted Oct 25, 2005·71 cites·19 claims
- 2294US5968333AMethod of electroplating a copper or copper alloy interconnectADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 19, 1999·153 cites·14 claims
- 2393US7276801B2Designs and methods for conductive bumpsINTEL CORP·Filed 2003·Granted Oct 2, 2007·56 cites·24 claims
- 2493US7008872B2Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structuresINTEL CORP·Filed 2002·Granted Mar 7, 2006·59 cites·16 claims
- 2593US6696758B2Interconnect structures and a method of electroless introduction of interconnect structuresINTEL CORP·Filed 2002·Granted Feb 24, 2004·57 cites·14 claims
- 2693US6518184B1Enhancement of an interconnectINTEL CORP·Filed 2002·Granted Feb 11, 2003·61 cites·20 claims
- 2793US6491806B1Electroplating bath compositionINTEL CORP·Filed 2000·Granted Dec 10, 2002·59 cites·16 claims
- 2892US9105628B1Through substrate via (TSuV) structures and method of making the sameDUBIN VALERY·Filed 2012·Granted Aug 11, 2015·12 cites·15 claims
- 2992US7635503B2Composite metal films and carbon nanotube fabricationINTEL CORP·Filed 2006·Granted Dec 22, 2009·16 cites·15 claims
- 3091US7682891B2Tunable gate electrode work function material for transistor applicationsINTEL CORP·Filed 2006·Granted Mar 23, 2010·19 cites·20 claims
- 3191US6977224B2Method of electroless introduction of interconnect structuresINTEL CORP·Filed 2000·Granted Dec 20, 2005·50 cites·26 claims
- 3291US6933222B2Microcircuit fabrication and interconnectionINTEL CORP·Filed 2003·Granted Aug 23, 2005·53 cites·7 claims
- 3391US6432821B1Method of copper electroplatingINTEL CORP·Filed 2000·Granted Aug 13, 2002·145 cites·31 claims
- 3491US5833820AElectroplating apparatusADVANCED MICRO DEVICES INC·Filed 1997·Granted Nov 10, 1998·91 cites·15 claims
- 3590US7586196B2Apparatus for an improved air gap interconnect structureINTEL CORP·Filed 2007·Granted Sep 8, 2009·16 cites·25 claims
- 3690US7476967B2Composite carbon nanotube thermal interface deviceINTEL CORP·Filed 2006·Granted Jan 13, 2009·15 cites·8 claims
- 3790US7049234B2Multiple stage electroless deposition of a metal layerINTEL CORP·Filed 2003·Granted May 23, 2006·37 cites·26 claims
- 3889US7208327B2Metal oxide sensors and method of formingINTEL CORP·Filed 2005·Granted Apr 24, 2007·14 cites·13 claims
- 3988US8278121B2Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesisDUBIN VALERY M·Filed 2011·Granted Oct 2, 2012·5 cites·26 claims
- 4088US6893550B2Electroplating bath composition and method of usingINTEL CORP·Filed 2001·Granted May 17, 2005·25 cites·10 claims
- 4187US7365011B2Catalytic nucleation monolayer for metal seed layersINTEL CORP·Filed 2005·Granted Apr 29, 2008·12 cites·25 claims
- 4287US7338585B2Electroplating chemistries and methods of forming interconnectionsINTEL CORP·Filed 2006·Granted Mar 4, 2008·12 cites·21 claims
- 4387US7192856B2Forming dual metal complementary metal oxide semiconductor integrated circuitsINTEL CORP·Filed 2005·Granted Mar 20, 2007·13 cites·20 claims
- 4485US8319287B2Tunable gate electrode work function material for transistor applicationsLAVOIE ADRIEN R·Filed 2010·Granted Nov 27, 2012·7 cites·18 claims
- 4585US7847394B2Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interfaceINTEL CORP·Filed 2005·Granted Dec 7, 2010·10 cites·7 claims
- 4685US7122461B2Method to assemble structures from nano-materialsINTEL CORP·Filed 2005·Granted Oct 17, 2006·14 cites·24 claims
- 4785US7112472B2Methods of fabricating a composite carbon nanotube thermal interface deviceINTEL CORP·Filed 2003·Granted Sep 26, 2006·28 cites·26 claims
- 4884US7633080B2Method to assemble structures from nano-materialsINTEL CORP·Filed 2006·Granted Dec 15, 2009·12 cites·19 claims
- 4984US7279423B2Forming a copper diffusion barrierINTEL CORP·Filed 2002·Granted Oct 9, 2007·26 cites·10 claims
- 5083US9391054B2Method of making the light source structure in flexible substrateDUBIN VALERY·Filed 2015·Granted Jul 12, 2016·3 cites·13 claims
Showing the top 50 of 152 patent records by PatentIndex Score.
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