Inventor · disambiguated record
Po-Jen Wang
Also filed as: WANG PO-JEN
26 granted patents·7 pending applications·20 citations·filing 2003–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24SINTAI OPTICAL SHENZHEN CO LTD3ASIA OPTICAL CO INC1REALTEK SEMICONDUCTOR CORP1STONERIDGE ELECTRONICS AB1
Top patents by PatentIndex Score
33 records- 0197US11367778B2MOSFET device structure with air-gaps in spacer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 21, 2022·4 cites·20 claims
- 0297US11335638B2Reducing RC delay in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·5 cites·20 claims
- 0394US11817345B2Multiple thickness semiconductor-on-insulator field effect transistors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0491US11804439B2Reducing RC delay in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 31, 2023·1 cites·20 claims
- 0590US2025351530A1Mosfet device structure with air-gaps in spacer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0685US12446289B2MOSFET device structure with air-gaps in spacer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0783US2024379563A1Reducing rc delay in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0882US12230574B2Reducing RC delay in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0978US11855170B2MOSFET device structure with air-gaps in spacer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1077US11513317B2Lens device under cover glass and lens assemblySINTAI OPTICAL SHENZHEN CO LTD·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 1176US10804389B2LDMOS transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 13, 2020·2 cites·20 claims
- 1275US12414322B2LDMOS transistor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1373US11855137B2SOI device structure for robust isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·9 claims
- 1473US2023387197A1Novel soi device structure for robust isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1572US10699963B2Structure and formation method of semiconductor device structure with isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 30, 2020·1 cites·20 claims
- 1672US10483153B2Deep trench isolation structure in semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·1 cites·20 claims
- 1769US11682549B2Semiconductor wafer with modified surface and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 1868US11257902B2SOI device structure for robust isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·19 claims
- 1965US11488872B2Method for forming semiconductor device structure with isolation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 2064US11855202B2LDMOS transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 2162US2025370946A1Chipset apparatus and communication method thereof having dynamic bandwidth distribution mechanismREALTEK SEMICONDUCTOR CORP·Filed 2025·Application pending·0 cites
- 2260US11201082B2Deep trench isolation structure in semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 2360US9165880B2Process control methods for CMP (chemical mechanical polishing) and other polishing methods used to form semiconductor devicesWANG PO-JEN·Filed 2012·Granted Oct 20, 2015·3 cites·20 claims
- 2459US11398403B2Multiple thickness semiconductor-on-insulator field effect transistors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 2559US10916416B2Semiconductor wafer with modified surface and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·20 claims
- 2658US2025373916A1Lens deviceASIA OPTICAL CO INC·Filed 2025·Application pending·0 cites
- 2755US12466323B2Method and apparatus for determining trailer angleSTONERIDGE ELECTRONICS AB·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 2854US11171199B2Metal-insulator-metal capacitors with high breakdown voltageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims
- 2953US11428893B2Lens deviceSINTAI OPTICAL SHENZHEN CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·19 claims
- 3045US2020110240A1Lens ModuleSINTAI OPTICAL SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
- 3143US7704885B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Apr 27, 2010·0 cites·16 claims
- 3241US2004200899A1Automatic toll collection architecture and method combining short-range and long-range communication schemesFiled 2003·Application pending·0 cites
- 3339US9449976B2Semiconductor device structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →