Inventor · disambiguated record
Ross S. Dando
Also filed as: DANDO ROSS · DANDO ROSS S
62 granted patents·35 pending applications·1,812 citations·filing 1997–2024
99Inventor score
Files withMICRON TECHNOLOGY INC65BLOMILEY ERIC R12DANDO ROSS S6CARPENTER CRAIG M2MICRON COMMUNICATIONS INC2
Top patents by PatentIndex Score
97 records- 0198US7387685B2Apparatus and method for depositing materials onto microelectronic workpiecesMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 17, 2008·502 cites·16 claims
- 0296US6845734B2Deposition apparatuses configured for utilizing phased microwave radiationMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 25, 2005·59 cites·19 claims
- 0396US6838114B2Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 4, 2005·77 cites·38 claims
- 0496US6821347B2Apparatus and method for depositing materials onto microelectronic workpiecesMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 23, 2004·94 cites·54 claims
- 0595US6797337B2Method for delivering precursorsMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 28, 2004·60 cites·29 claims
- 0695US6161281ABattery mounting apparatuses, electronic devices, and methods of forming electrical connectionsMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 19, 2000·112 cites·5 claims
- 0794US7863187B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 4, 2011·22 cites·39 claims
- 0893US5863813AMethod of processing semiconductive material wafers and method of forming flip chips and semiconductor chipsMICRON COMMUNICATIONS INC·Filed 1997·Granted Jan 26, 1999·103 cites·35 claims
- 0992US11476160B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 18, 2022·2 cites·20 claims
- 1092US6814813B2Chemical vapor deposition apparatusMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 9, 2004·45 cites·15 claims
- 1192US6677250B2CVD apparatuses and methods of forming a layer over a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 13, 2004·56 cites·19 claims
- 1290US6613587B1Method of replacing at least a portion of a semiconductor substrate deposition chamber linerMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 2, 2003·33 cites·28 claims
- 1389US6545604B1Methods for electronic tracking of units originating from a common source, and assemblies comprising transponders attached to meat spikesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 8, 2003·69 cites·45 claims
- 1489US6074896AMethod of processing semiconductor material wafers and method of forming flip chips and semiconductor chipsMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 13, 2000·77 cites·31 claims
- 1588US7749899B2Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpiecesMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 6, 2010·17 cites·55 claims
- 1687USRE41562ESystem and method for electronic tracking of units associated with a batchROUND ROCK RES LLC·Filed 2005·Granted Aug 24, 2010·12 cites·82 claims
- 1787US7422986B2Deposition methods utilizing microwave excitationMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 9, 2008·5 cites·9 claims
- 1887US6858264B2Chemical vapor deposition methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 22, 2005·28 cites·58 claims
- 1987US6166637AApparatuses for electronic identification of a plurality of passing units and methods of electronic identification of a plurality of passing unitsMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 26, 2000·58 cites·67 claims
- 2087US2024339360A1Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2186US6926775B2Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 9, 2005·25 cites·38 claims
- 2285US7560371B2Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuumMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 14, 2009·14 cites·32 claims
- 2385US7185601B2Chemically sensitive warning apparatus and methodMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 6, 2007·27 cites·32 claims
- 2485US6800172B2Interfacial structure for semiconductor substrate processing chambers and substrate transfer chambers and for semiconductor substrate processing chambers and accessory attachments, and semiconductor substrate processorMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 5, 2004·30 cites·68 claims
- 2582US12014958B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 18, 2024·0 cites·7 claims
- 2681USRE41815ESystem and method for electronic tracking of units associated with a batchROUND ROCK RES LLC·Filed 2007·Granted Oct 12, 2010·5 cites·96 claims
- 2781US7311947B2Laser assisted material depositionMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 25, 2007·19 cites·13 claims
- 2879US7662649B2Methods for assessing alignments of substrates within deposition apparatuses; and methods for assessing thicknesses of deposited layers within deposition apparatusesMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 16, 2010·5 cites·40 claims
- 2975US8314498B2Isolated bond pad with conductive via interconnectHUTTO KEVIN·Filed 2010·Granted Nov 20, 2012·6 cites·15 claims
- 3075US6687969B1Methods of fixturing flexible substrates and methods of processing flexible substratesMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 10, 2004·37 cites·23 claims
- 3175US6051875ASemiconductor chipMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 18, 2000·33 cites·48 claims
- 3274US6955725B2Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 18, 2005·10 cites·56 claims
- 3373US7118783B2Methods and apparatus for vapor processing of micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 10, 2006·10 cites·21 claims
- 3473US6935372B2Semiconductor processing reactive precursor valve assemblyMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 30, 2005·1 cites·14 claims
- 3572US7270715B2Chemical vapor deposition apparatusMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 18, 2007·9 cites·39 claims
- 3672US7234412B2Semiconductor substrate deposition processor chamber liner apparatusMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 26, 2007·9 cites·7 claims
- 3770USRE44409EMethod for electronic tracking of units associated with a batchDANDO ROSS S·Filed 2011·Granted Aug 6, 2013·1 cites·77 claims
- 3870US8076244B2Methods for causing fluid to flow through or into via holes, vents and other openings or recesses that communicate with surfaces of substrates of semiconductor device componentsDANDO ROSS S·Filed 2006·Granted Dec 13, 2011·2 cites·39 claims
- 3970US6620253B1Engagement mechanism for semiconductor substrate deposition process kit hardwareMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·20 cites·39 claims
- 4069US6787373B2Method of replacing at least a portion of semiconductor substrate deposition process kit hardware, and method of depositing materials over a plurality of semiconductor substratesMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 7, 2004·7 cites·17 claims
- 4167US7588804B2Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 15, 2009·6 cites·8 claims
- 4267US6980085B1Wireless communication devices and methods of forming and operating the sameMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 27, 2005·10 cites·97 claims
- 4366US9023436B2Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpiecesDANDO ROSS S·Filed 2012·Granted May 5, 2015·0 cites·9 claims
- 4464US7481887B2Apparatus for controlling gas pulsing in processes for depositing materials onto micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 27, 2009·5 cites·21 claims
- 4564US6936547B2Gas delivery system for deposition processes, and methods of using sameMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 30, 2005·5 cites·113 claims
- 4663US9653381B2Semiconductor structures and die assemblies including conductive vias and thermally conductive elements and methods of forming such structuresMICRON TECHNOLOGY INC·Filed 2014·Granted May 16, 2017·1 cites·30 claims
- 4763US7427425B2Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 23, 2008·4 cites·23 claims
- 4863US2015247236A1Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 4962US7000636B2Valve assemblies for use with a reactive precursor in semiconductor processingMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 21, 2006·3 cites·26 claims
- 5061US6800134B2Chemical vapor deposition methods and atomic layer deposition methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 5, 2004·6 cites·53 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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