Inventor · disambiguated record
Kai-Ping Huang
Also filed as: HUANG KAI · HUANG KAI PING
7 granted patents·3 pending applications·5 citations·filing 2004–2023
73Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3UNITED SEMICONDUCTOR XIAMEN CO LTD3UNITED MICROELECTRONICS CORP2HUANG KAI-PING1SIEMENS WESTINGHOUSE POWER1
Top patents by PatentIndex Score
10 records- 0187US10840237B2Electrostatic discharge protection circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·4 cites·20 claims
- 0277US11676959B2Electrostatic discharge protection circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 0366US11404409B2Electrostatic discharge protection circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 0463US12443178B2Machine monitoring system and machine monitoring methodUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·18 claims
- 0558US8666140B2Defect inspection method for wafer and wafer defect inspection system using the sameHUANG KAI-PING·Filed 2012·Granted Mar 4, 2014·1 cites·12 claims
- 0650US2024112323A1Method for detecting defects on wafers, system for detecting defects on wafersUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2022·Application pending·0 cites
- 0741US11387150B2Fabricating method of decreasing height difference of STIUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·8 claims
- 0838US2008261384A1Method of removing photoresist layer and method of fabricating semiconductor device using the sameUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0937US7899635B2Sampling inspection methodUNITED MICROELECTRONICS CORP·Filed 2008·Granted Mar 1, 2011·0 cites·15 claims
- 1033US2005038817A1System and method for processing inspection data for evaluating degradation of coating on componentsSIEMENS WESTINGHOUSE POWER·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →