Inventor · disambiguated record
Huan Chi Tseng
Also filed as: TSENG HUAN-CHI
19 granted patents·1 pending application·111 citations·filing 1995–2019
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG10TAIWAN SEMICONDUCTOR MFG CO LTD4SHAO JHIH-JIE2CHAO CHIEN-JU1HUANG SZU-CHIA1
Top patents by PatentIndex Score
20 records- 0189US8978003B1Method of making semiconductor device and a control system for performing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 10, 2015·10 cites·20 claims
- 0272US10520545B2Method and apparatus for testing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 31, 2019·1 cites·7 claims
- 0372US8531201B2Method and apparatus for testing a semiconductor deviceSHAO JHIH-JIE·Filed 2011·Granted Sep 10, 2013·3 cites·20 claims
- 0472US5949547ASystem for in-line monitoring of photo processing in VLSI fabricationTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Sep 7, 1999·37 cites·7 claims
- 0571US9459316B2Method and apparatus for testing a semiconductor deviceHUANG SZU-CHIA·Filed 2011·Granted Oct 4, 2016·3 cites·18 claims
- 0671US9075101B2Method and apparatus for testing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·2 cites·20 claims
- 0769US7545045B2Dummy via for reducing proximity effect and method of using the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 9, 2009·9 cites·8 claims
- 0867US11150296B2Method and apparatus for testing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 0963US6943062B2Contaminant particle removal by optical tweezersTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 13, 2005·11 cites·21 claims
- 1062US8499274B2Computer implemented system and method for leakage calculationCHAO CHIEN-JU·Filed 2012·Granted Jul 30, 2013·2 cites·20 claims
- 1161US9151798B2Method and apparatus for testing a semiconductor deviceSHAO JHIH JIE·Filed 2011·Granted Oct 6, 2015·2 cites·20 claims
- 1259US9995770B2Multidirectional semiconductor arrangement testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 12, 2018·1 cites·20 claims
- 1358US7015129B2Bond pad scheme for Cu processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 21, 2006·7 cites·20 claims
- 1456US7160811B2Laminated silicate glass layer etch stop method for fabricating microelectronic productTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jan 9, 2007·5 cites·19 claims
- 1553US8674355B2Integrated circuit test units with integrated physical and electrical test regionsTSENG HUAN-CHI·Filed 2010·Granted Mar 18, 2014·1 cites·18 claims
- 1652US9639647B2Method of making semiconductor device and system for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·0 cites·20 claims
- 1749US6844626B2Bond pad scheme for Cu processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jan 18, 2005·3 cites·13 claims
- 1840US5685947AChemical-mechanical polishing with an embedded abrasiveTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Nov 11, 1997·8 cites·13 claims
- 1939US5990567ASystem for in-line monitoring of photo processing tilt in VLSI fabricationTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 23, 1999·6 cites·14 claims
- 2033US2004266174A1Method and apparatus of preventing tungsten pullout during tungsten chemical mill processingFiled 2003·Application pending·0 cites
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