Inventor · disambiguated record
Kwang-Ho Chun
Also filed as: CHUN KWANG-HO
6 granted patents·5 pending applications·89 citations·filing 2004–2011
82Inventor score
Top patents by PatentIndex Score
11 records- 0194US7215026B2Semiconductor module and method of forming a semiconductor moduleSAMSUNG ELECTONICS CO LTD·Filed 2005·Granted May 8, 2007·42 cites·36 claims
- 0288US7518873B2Heat spreader, semiconductor package module and memory module having the heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 14, 2009·20 cites·37 claims
- 0387US7606035B2Heat sink and memory module using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 20, 2009·19 cites·23 claims
- 0468US7705449B2Cooling apparatus for memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 27, 2010·4 cites·42 claims
- 0557US7675176B2Semiconductor package and module printed circuit board for mounting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 9, 2010·1 cites·19 claims
- 0651US2007161224A1Semiconductor module and method of forming a semiconductor modulePARK CHANG-YONG·Filed 2007·Application pending·0 cites
- 0750US2009257209A1Semiconductor package and associated methodsHAN SEONG-CHAN·Filed 2009·Application pending·0 cites
- 0850US2007069378A1Semiconductor module and method of forming a semiconductor modulePARK CHANG-YONG·Filed 2006·Application pending·0 cites
- 0944US7005735B2Array printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 28, 2006·3 cites·12 claims
- 1039US2006228878A1Semiconductor package repair methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1137US2011168761A1Apparatus for repairing semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →