Inventor · disambiguated record
Yuan-Chih Lee
Also filed as: LEE YUAN-CHIH
12 granted patents·24 citations·filing 2016–2021
86Inventor score
Files withUNIFLEX TECH INC12
Top patents by PatentIndex Score
12 records- 0189US11140773B2Substrate structure with high reflectance and method for manufacturing the sameUNIFLEX TECH INC·Filed 2020·Granted Oct 5, 2021·2 cites·12 claims
- 0289US10729007B2Substrate structure with high reflectance and method for manufacturing the sameUNIFLEX TECH INC·Filed 2019·Granted Jul 28, 2020·4 cites·13 claims
- 0387US9860978B1Rigid-flex board structureUNIFLEX TECH INC·Filed 2017·Granted Jan 2, 2018·11 cites·16 claims
- 0486US10333042B1Package structure for displayUNIFLEX TECH INC·Filed 2018·Granted Jun 25, 2019·6 cites·11 claims
- 0575US11937370B2Method for manufacturing a substrate structure with high reflectanceUNIFLEX TECH INC·Filed 2021·Granted Mar 19, 2024·0 cites·6 claims
- 0674US11979980B2Method of fabricating a substrate with metal reflection layerUNIFLEX TECH INC·Filed 2021·Granted May 7, 2024·0 cites·5 claims
- 0770US11147157B2Substrate structure with high reflectance and method for manufacturing the sameUNIFLEX TECH INC·Filed 2020·Granted Oct 12, 2021·0 cites·10 claims
- 0864US10580350B2Micro light emitting diode module and manufacturing method thereofUNIFLEX TECH INC·Filed 2018·Granted Mar 3, 2020·1 cites·1 claims
- 0948US10580951B2Package structure for backlight moduleUNIFLEX TECH INC·Filed 2018·Granted Mar 3, 2020·0 cites·10 claims
- 1044US9844131B2Rigid-flex circuit board and manufacturing method thereofUNIFLEX TECH INC·Filed 2016·Granted Dec 12, 2017·0 cites·21 claims
- 1143US10104778B2Flexible printed circuit board structureUNIFLEX TECH INC·Filed 2017·Granted Oct 16, 2018·0 cites·6 claims
- 1239US10306767B2Manufacturing method for forming substrate structure comprising viasUNIFLEX TECH INC·Filed 2017·Granted May 28, 2019·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →