Inventor · disambiguated record
Meng-Huan Chia
Also filed as: CHIA MENG-HUAN
9 granted patents·20 citations·filing 2017–2023
83Inventor score
Top patents by PatentIndex Score
9 records- 0196US11764188B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Sep 19, 2023·7 cites·10 claims
- 0291US12255182B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Mar 18, 2025·1 cites·14 claims
- 0389US11140773B2Substrate structure with high reflectance and method for manufacturing the sameUNIFLEX TECH INC·Filed 2020·Granted Oct 5, 2021·2 cites·12 claims
- 0489US10729007B2Substrate structure with high reflectance and method for manufacturing the sameUNIFLEX TECH INC·Filed 2019·Granted Jul 28, 2020·4 cites·13 claims
- 0586US10333042B1Package structure for displayUNIFLEX TECH INC·Filed 2018·Granted Jun 25, 2019·6 cites·11 claims
- 0675US11937370B2Method for manufacturing a substrate structure with high reflectanceUNIFLEX TECH INC·Filed 2021·Granted Mar 19, 2024·0 cites·6 claims
- 0774US11979980B2Method of fabricating a substrate with metal reflection layerUNIFLEX TECH INC·Filed 2021·Granted May 7, 2024·0 cites·5 claims
- 0870US11147157B2Substrate structure with high reflectance and method for manufacturing the sameUNIFLEX TECH INC·Filed 2020·Granted Oct 12, 2021·0 cites·10 claims
- 0943US10104778B2Flexible printed circuit board structureUNIFLEX TECH INC·Filed 2017·Granted Oct 16, 2018·0 cites·6 claims
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