Inventor · disambiguated record
Erich W. Gerbsch
Also filed as: GERBSCH ERICH W · GERBSCH ERICH WILLIAM
13 granted patents·4 pending applications·446 citations·filing 1998–2012
93Inventor score
Top patents by PatentIndex Score
17 records- 0196US7295433B2Electronics assembly having multiple side cooling and methodDELPHI TECH INC·Filed 2005·Granted Nov 13, 2007·63 cites·21 claims
- 0292US8699225B2Liquid cooled electronics assembly suitable to use electrically conductive coolantBRANDENBURG SCOTT D·Filed 2012·Granted Apr 15, 2014·15 cites·19 claims
- 0392US6812553B2Electrically isolated and thermally conductive double-sided pre-packaged componentDELPHI TECH INC·Filed 2002·Granted Nov 2, 2004·70 cites·10 claims
- 0491US7095098B2Electrically isolated and thermally conductive double-sided pre-packaged componentDELPHI TECH INC·Filed 2004·Granted Aug 22, 2006·61 cites·5 claims
- 0590US7538425B2Power semiconductor package having integral fluid coolingDELPHI TECH INC·Filed 2004·Granted May 26, 2009·74 cites·7 claims
- 0688US6639798B1Automotive electronics heat exchangerDELPHI TECH INC·Filed 2002·Granted Oct 28, 2003·47 cites·24 claims
- 0783US6054765AParallel dual switch moduleDELCO ELECTRONICS CORP·Filed 1998·Granted Apr 25, 2000·87 cites·14 claims
- 0881US7834448B2Fluid cooled semiconductor power module having double-sided coolingDELPHI TECH INC·Filed 2007·Granted Nov 16, 2010·11 cites·14 claims
- 0960US7697303B2Dual-sided substrate integrated circuit package including a leadframe having leads with increased thicknessDELPHI TECH INC·Filed 2008·Granted Apr 13, 2010·1 cites·5 claims
- 1059US7960817B2Semiconductor power module with flexible circuit leadframeDELPHI TECH INC·Filed 2007·Granted Jun 14, 2011·2 cites·10 claims
- 1157US7148564B2Dual-sided substrate integrated circuit package including a leadframe having leads with increased thicknessDELPHI TECH INC·Filed 2004·Granted Dec 12, 2006·6 cites·5 claims
- 1252US7423332B2Vertical laminated electrical switch circuitDELPHI TECH INC·Filed 2003·Granted Sep 9, 2008·6 cites·21 claims
- 1348US2007069348A1Dual-sided substrate integrated circuit package including a leadframe having leads with increased thicknessDELPHI TECH INC·Filed 2006·Application pending·0 cites
- 1446US2010133672A1Dual-sided substate integrated circuit package including a leadframe having leads with increased thicknessDELPHI TECH INC·Filed 2010·Application pending·0 cites
- 1544US6575765B2Interconnect assembly for an electronic assembly and assembly method thereforDELPHI TECH INC·Filed 2001·Granted Jun 10, 2003·3 cites·36 claims
- 1638US2009001546A1Ultra-thick thick film on ceramic substrateFLEDERBACH LYNDA G·Filed 2007·Application pending·0 cites
- 1737US2004094828A1Double-sided multi-chip circuit componentDELPHI TECH INC·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →