Inventor · disambiguated record
David G. Figueroa
Also filed as: FIGUEROA DAVID · FIGUEROA DAVID G · FIGUEROA DAVID GREGORY
57 granted patents·5 pending applications·2,036 citations·filing 1999–2007
99Inventor score
Top patents by PatentIndex Score
62 records- 0199US6388207B1Electronic assembly with trench structures and methods of manufactureINTEL CORP·Filed 2000·Granted May 14, 2002·238 cites·52 claims
- 0298US6446317B1Hybrid capacitor and method of fabrication thereforINTEL CORP·Filed 2000·Granted Sep 10, 2002·208 cites·16 claims
- 0397US7518248B2Inductive filters and methods of fabrication thereforINTEL CORP·Filed 2006·Granted Apr 14, 2009·46 cites·15 claims
- 0497US6346743B1Embedded capacitor assembly in a packageINTEL CORP·Filed 2000·Granted Feb 12, 2002·127 cites·43 claims
- 0596US6606237B1Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the sameMURATA MANUFACTURING CO·Filed 2002·Granted Aug 12, 2003·231 cites·43 claims
- 0696US6407929B1Electronic package having embedded capacitors and method of fabrication thereforINTEL CORP·Filed 2000·Granted Jun 18, 2002·220 cites·29 claims
- 0795US6775150B1Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufactureINTEL CORP·Filed 2000·Granted Aug 10, 2004·70 cites·33 claims
- 0895US6532143B2Multiple tier array capacitorINTEL CORP·Filed 2000·Granted Mar 11, 2003·101 cites·14 claims
- 0994US6366467B1Dual-socket interposer and method of fabrication thereforINTEL CORP·Filed 2000·Granted Apr 2, 2002·97 cites·12 claims
- 1093US6493861B1Interconnected series of plated through hole vias and method of fabrication thereforINTEL CORP·Filed 1999·Granted Dec 10, 2002·73 cites·35 claims
- 1188US7133294B2Integrated circuit packages with sandwiched capacitorsINTEL CORP·Filed 2005·Granted Nov 7, 2006·16 cites·24 claims
- 1287US6469908B2Dual-socket interposer and method of fabrication thereforINTEL CORP·Filed 2002·Granted Oct 22, 2002·40 cites·7 claims
- 1386US6920051B2Hybrid capacitor, circuit, and systemINTEL CORP·Filed 2002·Granted Jul 19, 2005·37 cites·11 claims
- 1486US6559484B1Embedded enclosure for effective electromagnetic radiation reductionINTEL CORP·Filed 2000·Granted May 6, 2003·44 cites·30 claims
- 1585US7120031B2Data processing system comprising ceramic/organic hybrid substrate with embedded capacitorsINTEL CORP·Filed 2004·Granted Oct 10, 2006·26 cites·3 claims
- 1684US6555920B2Vertical electronic circuit packageINTEL CORP·Filed 2001·Granted Apr 29, 2003·25 cites·20 claims
- 1783US7535728B2Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitorsINTEL CORP·Filed 2006·Granted May 19, 2009·8 cites·15 claims
- 1883US6672912B2Discrete device socket and method of fabrication thereforINTEL CORP·Filed 2000·Granted Jan 6, 2004·30 cites·15 claims
- 1983US6558181B2System and method for package socket with embedded power and ground planesINTEL CORP·Filed 2000·Granted May 6, 2003·30 cites·7 claims
- 2082US6483692B2Capacitor with extended surface lands and method of fabrication thereforINTEL CORP·Filed 2000·Granted Nov 19, 2002·33 cites·29 claims
- 2180US6558169B2Shunt power connection for an integrated circuit packageINTEL CORP·Filed 2001·Granted May 6, 2003·24 cites·26 claims
- 2280US6556453B2Electronic circuit housing with trench vias and method of fabrication thereforINTEL CORP·Filed 2000·Granted Apr 29, 2003·26 cites·29 claims
- 2379US6519134B1Universal capacitor terminal designINTEL CORP·Filed 2000·Granted Feb 11, 2003·28 cites·10 claims
- 2475US7417872B2Circuit board with trace configuration for high-speed digital differential signalingINTEL CORP·Filed 2006·Granted Aug 26, 2008·5 cites·5 claims
- 2575US6900991B2Electronic assembly with sandwiched capacitors and methods of manufactureINTEL CORP·Filed 2001·Granted May 31, 2005·20 cites·42 claims
- 2675US6509640B1Integral capacitor using embedded enclosure for effective electromagnetic radiation reductionINTEL CORP·Filed 2000·Granted Jan 21, 2003·32 cites·30 claims
- 2773US6495770B2Electronic assembly providing shunting of electrical currentINTEL CORP·Filed 2000·Granted Dec 17, 2002·21 cites·20 claims
- 2872US7111271B2Inductive filters and methods of fabrication thereofINTEL CORP·Filed 2002·Granted Sep 19, 2006·12 cites·8 claims
- 2971US6428358B1Socket with embedded conductive structure and method of fabrication thereforINTEL CORP·Filed 2000·Granted Aug 6, 2002·13 cites·14 claims
- 3070US6877223B2Method of fabrication for a socket with embedded conductive structureINTEL CORP·Filed 2002·Granted Apr 12, 2005·16 cites·8 claims
- 3169US6717277B2Electrical assembly with vertical multiple layer structureINTEL CORP·Filed 2003·Granted Apr 6, 2004·10 cites·25 claims
- 3269US6680218B2Fabrication method for vertical electronic circuit package and systemINTEL CORP·Filed 2003·Granted Jan 20, 2004·10 cites·21 claims
- 3368US7492605B2Power plane to reduce voltage difference between connector power pinsINTEL CORP·Filed 2006·Granted Feb 17, 2009·4 cites·8 claims
- 3465US7975158B2Noise reduction method by implementing certain port-to-port delayINTEL CORP·Filed 2007·Granted Jul 5, 2011·4 cites·14 claims
- 3565US7358607B2Substrates and systems to minimize signal path discontinuitiesINTEL CORP·Filed 2002·Granted Apr 15, 2008·12 cites·11 claims
- 3665US6584685B2System and method for package socket with embedded power and ground planesINTEL CORP·Filed 2001·Granted Jul 1, 2003·10 cites·9 claims
- 3761US6811410B2Integrated circuit socket with capacitors and shuntsINTEL CORP·Filed 2002·Granted Nov 2, 2004·11 cites·6 claims
- 3860US6914334B2Circuit board with trace configuration for high-speed digital differential signalingINTEL CORP·Filed 2002·Granted Jul 5, 2005·7 cites·8 claims
- 3960US6545346B2Integrated circuit package with a capacitorINTEL CORP·Filed 2001·Granted Apr 8, 2003·9 cites·30 claims
- 4059US7215530B2High ESR low ESL capacitorINTEL CORP·Filed 2005·Granted May 8, 2007·2 cites·22 claims
- 4157US8166215B2Method to control delay between lanesVENKATARAMAN SRIKRISHNAN·Filed 2005·Granted Apr 24, 2012·2 cites·17 claims
- 4257US7212395B2Capacitor design for controlling equivalent series resistanceINTEL CORP·Filed 2004·Granted May 1, 2007·8 cites·22 claims
- 4355US6780057B2Coaxial dual pin sockets for high speed I/O applicationsINTEL CORP·Filed 2001·Granted Aug 24, 2004·4 cites·28 claims
- 4454US6784532B2Power/ground configuration for low impedance integrated circuitINTEL CORP·Filed 2002·Granted Aug 31, 2004·6 cites·20 claims
- 4550US7063569B2Coaxial dual pin sockets for high speed I/O applicationsINTEL CORP·Filed 2003·Granted Jun 20, 2006·2 cites·13 claims
- 4650US6964584B2Low impedance, high-power socket and method of usingINTEL CORP·Filed 2001·Granted Nov 15, 2005·5 cites·19 claims
- 4749US7286368B2System to control effective series resistance of decoupling capacitorINTEL CORP·Filed 2004·Granted Oct 23, 2007·3 cites·4 claims
- 4849US7145239B2Circuit board with trace configuration for high-speed digital differential signalingINTEL CORP·Filed 2004·Granted Dec 5, 2006·2 cites·14 claims
- 4949US6992387B2Capacitor-related systems for addressing package/motherboard resonanceINTEL CORP·Filed 2003·Granted Jan 31, 2006·3 cites·10 claims
- 5048US7205638B2Silicon building blocks in integrated circuit packagingINTEL CORP·Filed 2004·Granted Apr 17, 2007·2 cites·15 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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